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  TIM3.5-0912 Datasheet PDF File

For TIM3.5-0912 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Toshiba Corporation
Part No. TIM3742-35SL
Description MICROWAVE POWER GaAs FET

File Size 453.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 10136654-0912LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Tin plating, 9 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    TIM3742-16SL

Toshiba Semiconductor
Part No. TIM3742-16SL
Description
File Size 127.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 87409-125LF
Description Rib-Cage® Board To Board Connector, Surface Mount Vertical Shrouded PCB Header, 50 Positions, Locator Mounting style.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3438-16SL
Description MICROWAVE POWER GaAs FET

File Size 39.63K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-109121400LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3742-25UL
Description MICROWAVE POWER GaAs FET

File Size 45.67K  /  4 Page

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Amphenol Communications Solutions

Part No. 90309-124LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Header, Vertical, Through Hole, Double Row, 24 Positions
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3438-16SL
Description MICROWAVE POWER GaAs FET

File Size 39.75K  /  2 Page

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Amphenol Communications Solutions

Part No. 90309-128LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Header, Vertical, Through Hole, Double Row, 28 Positions
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-25UL
Description MICROWAVE POWER GaAs FET

File Size 44.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 10060912-201LF
Description GIG-Array®, Mezzanine Connectors, 15mm Receptacle 200 Position Lead Free.
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-12UL
Description MICROWAVE POWER GaAs FET

File Size 44.62K  /  4 Page

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Amphenol Communications Solutions

Part No. G86309121T1EU
Description Board mount - Header Receptacle - Wire to Board 2.5mm Pitch Vertical DIP,1x9Pin,Matte Tin,NY66,Tail=4.3mm,Color-White,Bag
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-35SL
Description MICROWAVE POWER GaAs FET

File Size 490.88K  /  4 Page

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Download Datasheet

   

Amphenol Communications Solutions

Part No. 10136656-0912LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, Tin plating, 9 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    TIM3742-16SL

Toshiba Semiconductor
Part No. TIM3742-16SL
Description MICRO WAVE POWER GaAs FET

File Size 156.36K  /  4 Page

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Amphenol Communications Solutions

Part No. 10119109-120001LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TIM3742-16UL

Toshiba Semiconductor
Part No. TIM3742-16UL
Description HIGH POWER P1dB=42.5dBm at 3.7GHz to 4.2GHz

File Size 44.99K  /  4 Page

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Amphenol Communications Solutions

Part No. 90309-122LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Header, Vertical, Through Hole, Double Row, 22 Positions
Tech specs    

Official Product Page

For TIM3.5-0912 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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