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Osram Opto Semiconductors GmbH OSRAM[OSRAM GmbH]
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Part No. |
F2000D
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OCR Text |
...ngth of chip edge (y-direction) durchmesser des Wafers Diameter of the wafer Chiphohe Die height Bondpaddurchmesser Diameter of bondpad Weitere Informationen Additional information2) Vorderseitenmetallisierung Metallization frontside Ruckse... |
Description |
InGaAlP-High Brightness-Lumineszenzdiode (617nm, High Current and Flux), InGaAlP High Brightness LED (617nm, High Current and Flux)
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File Size |
211.09K /
6 Page |
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durchmesser Found Datasheets File :: 81 Search Time::2.766ms Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | |
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