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  87834-1041 Datasheet PDF File

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    87834-2695

Molex Electronics Ltd.
Part No. 87834-2695
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
File Size 115.34K  /  3 Page

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Amphenol Communications Solutions
Part No. 10127721-041LF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 4 Position, 3.2mm Kink Tail (100u\\ Tin) plating, Non GW Compatible LCP, Black Color,Tray Packing.
Tech specs 　 　

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HUA FENG CIRCUIT





    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
File Size 115.26K  /  3 Page

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Amphenol Communications Solutions
Part No. 76345-104-16LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 16 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator
File Size 93.21K  /  3 Page

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Amphenol Communications Solutions
Part No. 75844-104-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87834-2645

Molex Electronics Ltd.
Part No. 87834-2645
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 26 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black
File Size 120.68K  /  3 Page

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Amphenol Communications Solutions
Part No. 51731-041LF
Description PwrBlade®, Power Supply Connectors, 32S 11P Right Angle Header.
Tech specs 　 　

Official Product Page

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating
File Size 115.34K  /  3 Page

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Amphenol Communications Solutions
Part No. U92A211104130
Description MiniSAS HD, High Speed Input Output Connector, 1X2 MINISAS HD.
Tech specs 　 　

Official Product Page

    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows
File Size 100.59K  /  3 Page

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Amphenol Communications Solutions
Part No. 54112-511041800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87834-4045

Molex Electronics Ltd.
Part No. 87834-4045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black
File Size 120.86K  /  3 Page

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Amphenol Communications Solutions
Part No. MUSB2B551041BP
Description Rugged USB Mini B Accessory, Input Output Connector, Panel Gasket, Conductive Rubber
Tech specs 　 　

Official Product Page

    87834-4093

Molex Electronics Ltd.
Part No. 87834-4093
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.76μm (30μ) Gold (Au) Plating, End Windows
File Size 100.60K  /  3 Page

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Amphenol Communications Solutions
Part No. 77319-104-10LF
Description BergStik®, Board to Board connector, Unshrouded right angled header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    87834-4021

Molex Electronics Ltd.
Part No. 87834-4021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating
File Size 124.35K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-411041700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    87834-2045

Molex Electronics Ltd.
Part No. 87834-2045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 20 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black
File Size 120.86K  /  3 Page

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Amphenol Communications Solutions
Part No. 54121-104120800LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Single Row, 12 Positions
Tech specs 　 　

Official Product Page

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