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UMS[United Monolithic Semiconductors]
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| Part No. |
CHA4042-99F_00 CHA4042 CHA4042-99F/00
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| OCR Text |
...
Values 6.25 450 -2 to +0.4 +8 +15 -45 to +80 -55 to +125
Unit V mA V V dBm C C
Operation of this device above any one of these parameters may cause permanent damage. Duration < 1 s AuSn solder mount to CuW or CuMo carrier assumed
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| Description |
Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Cable Receptacle; Insert Arrangement:14-5
23-34GHz High Power Amplifier
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| File Size |
90.37K /
6 Page |
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it Online |
Download Datasheet
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UMS[United Monolithic Semiconductors]
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| Part No. |
CHA6042-99F_00 CHA6042 CHA6042-99F/00
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| OCR Text |
...
1 1.36 0.35
6
1
9
8
7
2.34 0.35
Bond Pad 1 2 3 4 5 6 7 8 9 10
Symbol
x-dim.
y-dim.
x-center
y-center
RF input Vd1 Vd2 Vd3 Vd4 RF output
Vg4 Vg3 Vg2 Vg1
(um) 100 100 100 150 200 100 100 100 100 10... |
| Description |
Circular Connector; No. of Contacts:23; Series:; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:16; Circular Contact Gender:Pin; Circular Shell Style:Cable Receptacle; Insert Arrangement:16-23
13-16GHz High Power Amplifier
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| File Size |
89.42K /
6 Page |
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it Online |
Download Datasheet |
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INTERSIL[Intersil Corporation]
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| Part No. |
M24.173B
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| OCR Text |
...e number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension "b" does not include dambar protrusion. Allow...07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessa... |
| Description |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装（EPTSSOP
From old datasheet system
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| File Size |
39.10K /
1 Page |
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it Online |
Download Datasheet |
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Price and Availability
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