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  75757-0331 Datasheet PDF File

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    75757-1421

Molex Electronics Ltd.
Part No. 75757-1421
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5um (60u) Tin (Sn) Plating
File Size 166.43K  /  4 Page

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Rochester Electronics LLC
Part No. 100331/VYA
Description 100331 - 100K Series, Low Power Triple D-Type Flip-Flop - Dual marked (5962-9153601VYA) - SPACE-LEVEL LOGIC
Tech specs 　 　

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HUA FENG CIRCUIT





    75757-0432

Molex Electronics Ltd.
Part No. 75757-0432
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.18K  /  3 Page

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Amphenol Communications Solutions
Part No. 68033-122HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs 　 　

Official Product Page

    75757-0431

Molex Electronics Ltd.
Part No. 75757-0431
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
File Size 99.18K  /  3 Page

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Amphenol Communications Solutions
Part No. 68033-121HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs 　 　

Official Product Page

    75757-5181

Molex Electronics Ltd.
Part No. 75757-5181
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.50um (100u) Tin (Sn) Plating
File Size 166.21K  /  4 Page

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Amphenol Communications Solutions
Part No. 10106813-033112LF
Description 0.5 mm Pitch Hermaphroditic Mezzanine Connector, 30 positions, Standard length with pegs and hold-downs, Half of mated height equals 3 mm
Tech specs 　 　

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    75757-1362

Molex Electronics Ltd.
Part No. 75757-1362
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits
File Size 166.46K  /  4 Page

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Amphenol Communications Solutions
Part No. 74033-103LF
Description 74033-103LF-BLACK 30AU LF
Tech specs 　 　

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    75757-1241

Molex Electronics Ltd.
Part No. 75757-1241
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 8 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
File Size 166.48K  /  4 Page

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Amphenol Communications Solutions
Part No. UE86L462700331
Description ExpressPort SFP+, High Speed Input Output Connectors, 2X4SFP EXP PRT LRGR LP DIA.
Tech specs 　 　

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    75757-1322

Molex Electronics Ltd.
Part No. 75757-1322
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 0.75um (30u) Select Gold (Au) Plating
File Size 166.47K  /  4 Page

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Amphenol Communications Solutions
Part No. 10137785-033111LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, Nylon 66, 15u\\ Gold (Tin on Tails) plating, Natural Color, 3 Positions, GW Compatible, with Post, Tray packing.
Tech specs 　 　

Official Product Page

    75757-1332

Molex Electronics Ltd.
Part No. 75757-1332
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 0.75μm (30μ) Select Gold (Au) Plating, 11.20mm (.441) Mating Pin Length
File Size 166.47K  /  4 Page

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Amphenol Communications Solutions
Part No. 68033-113HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs 　 　

Official Product Page

    75757-1422

Molex Electronics Ltd.
Part No. 75757-1422
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
File Size 166.45K  /  4 Page

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Amphenol Communications Solutions
Part No. 68033-128HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs 　 　

Official Product Page

    75757-1431

Molex Electronics Ltd.
Part No. 75757-1431
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60u) Tin (Sn) Plating
File Size 166.42K  /  4 Page

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Amphenol Communications Solutions
Part No. 68033-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs 　 　

Official Product Page

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