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MIMIX[Mimix Broadband]
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Part No. |
XX1002
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OCR Text |
...de Metallization: Gold All Bond pads are 0.200 x 0.100 (0.008 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg. Bond Pad #1 (RF In) ... |
Description |
2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
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File Size |
370.74K /
5 Page |
View
it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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Part No. |
XS1000
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OCR Text |
...de Metallization: Gold All Bond pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg. Bond Pad #1 (RF In) B... |
Description |
7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
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File Size |
498.75K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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