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  bga-x18 Datasheet PDF File

For bga-x18 Found Datasheets File :: 544    Search Time::1.344ms    
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    NEC[NEC]
Part No. UPD44164364F5-E60-EQ1 UPD44164084 UPD44164084F5-E40-EQ1 UPD44164084F5-E50-EQ1 UPD44164084F5-E60-EQ1 UPD44164184F5-E40-EQ1 UPD44164184F5-E50-EQ1 UPD44164184F5-E60-EQ1 UPD44164364F5-E50-EQ1
OCR Text ...are packaged in 165-pin PLASTIC BGA. Features * 1.8 0.1 V power supply and HSTL I/O * DLL circuitry for wide output data valid window a...x18 and x36 devices. These inputs are ignored when device is deselected or once BURST operation is i...
Description 18M-BIT DDRII SRAM 4-WORD BURST OPERATION

File Size 387.78K  /  32 Page

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    NEC[NEC]
Part No. UPD44164365F5-E60-EQ1 UPD44164085 UPD44164085F5-E40-EQ1 UPD44164085F5-E50-EQ1 UPD44164085F5-E60-EQ1 UPD44164185F5-E40-EQ1 UPD44164185F5-E50-EQ1 UPD44164185F5-E60-EQ1 UPD44164365F5-E50-EQ1
OCR Text ...are packaged in 165-pin PLASTIC BGA. Features * 1.8 0.1 V power supply and HSTL I/O * DLL circuitry for wide output data valid window a...x18 device uses D0 to D17. x36 device uses D0 to D35. Q0 to Qxx Synchronous Data Outputs: Output dat...
Description 18M-BIT DDRII SRAM SEPARATE I/O 2-WORD BURST OPERATION

File Size 369.08K  /  32 Page

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    UPD44165362F5-E75-EQ1 UPD44165082 UPD44165082F5-E50-EQ1 UPD44165082F5-E60-EQ1 UPD44165082F5-E75-EQ1 UPD44165182F5-E50-EQ

NEC[NEC]
Part No. UPD44165362F5-E75-EQ1 UPD44165082 UPD44165082F5-E50-EQ1 UPD44165082F5-E60-EQ1 UPD44165082F5-E75-EQ1 UPD44165182F5-E50-EQ1 UPD44165182F5-E60-EQ1 UPD44165362F5-E50-EQ1 UPD44165362F5-E60-EQ1 UPD44165182F5-E75-EQ1 UPD44165362
OCR Text ...are packaged in 165-pin PLASTIC BGA. Features * 1.8 0.1 V power supply and HSTL I/O * DLL circuitry for wide output data valid window a...x18 device uses D0 to D17. x36 device uses D0 to D35. Q0 to Qxx Synchronous Data Outputs: Output dat...
Description (UPD44165082/182/362) 18M-BIT QDRII SRAM 2-WORD BURST OPERATION

File Size 378.93K  /  32 Page

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    NEC[NEC]
Part No. UPD44165364F5-E60-EQ1 UPD44165084 UPD44165084F5-E40-EQ1 UPD44165084F5-E50-EQ1 UPD44165084F5-E60-EQ1 UPD44165184F5-E40-EQ1 UPD44165184F5-E50-EQ1 UPD44165184F5-E60-EQ1 UPD44165364F5-E50-EQ1
OCR Text ...are packaged in 165-pin PLASTIC BGA. Features * 1.8 0.1 V power supply and HSTL I/O * DLL circuitry for wide output data valid window a...x18 device uses D0 to D17. x36 device uses D0 to D35. Q0 to Qxx Synchronous Data Outputs: Output dat...
Description 18M-BIT QDRII SRAM 4-WORD BURST OPERATION

File Size 385.89K  /  32 Page

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    CXK77K18R320GB CXK77K18R320GB-3 CXK77K18R320GB-33 CXK77K18R320GB-4

Sony Corporation
Part No. CXK77K18R320GB CXK77K18R320GB-3 CXK77K18R320GB-33 CXK77K18R320GB-4
OCR Text ...h, 14mm x 22mm Ball Grid Array (BGA) package 32Mb LW R-R, rev 0.8 1 / 23 December 8, 2004 SONY(R) CXK77K18R320GB 2Mb x 18 Pin...x18) TMS 3 SA SA SA VSS VSS VSS SBWb VSS VREF VSS VSS VSS VSS VSS M1 (1) SA TDI 4 NC SA (32M) VDD ZQ...
Description 32Mb LW R-R HSTL High Speed Synchronous SRAM (2Mb x 18)

File Size 192.86K  /  23 Page

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    CXK77K36R320GB CXK77K36R320GB-3 CXK77K36R320GB-33 CXK77K36R320GB-4

Sony Corporation
Part No. CXK77K36R320GB CXK77K36R320GB-3 CXK77K36R320GB-33 CXK77K36R320GB-4
OCR Text ...h, 14mm x 22mm Ball Grid Array (BGA) package 32Mb LW R-R, rev 0.6 1 / 22 March 16, 2004 SONY(R) CXK77K36R320GB 1Mb x 36 Pin A...x18) TMS 3 SA SA SA V SS V SS V SS SBWc V SS VREF V SS SBWd V SS V SS V SS M1 (1) SA TDI 4 NC SA (32...
Description 32Mb LW R-R HSTL High Speed Synchronous SRAM (1Mb x 36)

File Size 171.67K  /  22 Page

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    IDT72V273L7BC IDT72V273L7BCI IDT72V273L7PF IDT72V273L7PFI IDT72V223L7-5BC IDT72V223L7-5BCI IDT72V223L7-5PF IDT72V223L7-5

IDT
Integrated Device Technology
Part No. IDT72V273L7BC IDT72V273L7BCI IDT72V273L7PF IDT72V273L7PFI IDT72V223L7-5BC IDT72V223L7-5BCI IDT72V223L7-5PF IDT72V223L7-5PF8 IDT72V223L7-5PFI IDT72V233L7-5BC IDT72V233L7-5BCI IDT72V233L7-5PF IDT72V233L7-5PF8 IDT72V233L7-5PFI IDT72V243L7-5BC IDT72V243L7-5BCI IDT72V243L7-5PF IDT72V243L7-5PF8 IDT72V253L7-5BC IDT72V253L7-5BCI IDT72V263L7-5BC IDT72V263L7-5BCI IDT72V273L7-5BC IDT72V273L7-5BCI IDT72V283L7-5BC IDT72V283L7-5BCI IDT72V293L7-5BC IDT72V293L7-5BCI IDT72V243L7-5PFI IDT72V253L7-5PF IDT72V253L7-5PF8 IDT72V253L7-5PFI IDT72V263L7-5PF IDT72V263L7-5PF8 IDT72V263L7-5PFI IDT72V273L7-5PF IDT72V273L7-5PF8 IDT72V273L7-5PFI IDT72V283L7-5PF IDT72V283L7-5PF8 IDT72V283L7-5PFI IDT72V293L7-5PF IDT72V293L7-5PF8 IDT72V293L7-5PFI IDT72V233L6BC IDT72V223L6PF8 IDT72V233L6PF IDT72V233L6PF8 IDT72V273L10PF IDT72V273L10PFI
OCR Text ...ronous read and/or write ports (BGA Only) User selectable input and output port bus-sizing - x9 in to x9 out - x9 in to x18 out - x18 in to x9 out - x18 in to x18 out Pin to Pin compatible to the higher density of IDT72V2103/72V2113 Big-End...
Description 64K x 18 / 128K x 9 SuperSync II FIFO, 3.3V
32K x 18 / 64K x 9 SuperSync II FIFO, 3.3V
16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V
8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V
4K x 18 / 8K x 9 SuperSync II FIFO, 3.3V
2K x 18 / 4K x 9 SuperSync II FIFO, 3.3V
1K x 18 / 2K x 9 SuperSync II FIFO, 3.3V
512 x 18 / 1K x 9 SuperSync II FIFO, 3.3V
3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO

File Size 428.03K  /  45 Page

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    HM64YGB36100BP-33 HM64YGB36100

Renesas Electronics Corporation
Part No. HM64YGB36100BP-33 HM64YGB36100
OCR Text ...s packaged in standard 119-bump BGA. Note: All power supply and ground pins must be connected for proper operation of the device. Feature...x18 configuration HSTL compatible I/O Programmable impedance output drivers Differential HSTL clock ...
Description 32M Synchronous Late Write Fast Static RAM (1-Mword 】 36-bit)

File Size 200.07K  /  21 Page

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    TC59LM818DMB-40 TC59LM818DMB-33

Toshiba Semiconductor
Part No. TC59LM818DMB-40 TC59LM818DMB-33
OCR Text ...river) and HSTL Package: 60Ball BGA, 1mm x 1mm Ball pitch (P-BGA60-0917-1.00AZ) Notice: FCRAM is trademark of Fujitsu limited, Japan. ...x18 Address Input Bank Address Data Input/Output Chip Select Function Control Power Down Control Cl...
Description MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2

File Size 726.06K  /  57 Page

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    TC59LM818DMG-40 TC59LM818DMG-33

Toshiba Semiconductor
Part No. TC59LM818DMG-40 TC59LM818DMG-33
OCR Text ...river) and HSTL Package: 60Ball BGA, 1mm x 1mm Ball pitch (P-BGA60-0917-1.00AZ) Lead-Free Notice: FCRAM is trademark of Fujitsu limited, ...x18 Address Input Bank Address Data Input/Output Chip Select Function Control Power Down Control Cl...
Description MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 288Mbits Network FCRAM2

File Size 725.03K  /  57 Page

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For bga-x18 Found Datasheets File :: 544    Search Time::1.344ms    
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