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Myson Century
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| Part No. |
CS5841
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| OCR Text |
...gnal and clkv w time ? control asic output timing design is based on data enable signals ? resolution auto detect for svga, xga and sxga ? embedded power on reset circuits, vth=2.1v, tol- erance 0.3v ? esd spec. 4kv ? power on latch ... |
| Description |
LCD Panel Timing Controller
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| File Size |
165.16K /
17 Page |
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NXP Semiconductors N.V.
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| Part No. |
IP4786CZ32
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| OCR Text |
...cription 1 tmds_d2+_sys tmds to asic inside system 2tmds_d2 ? _sys tmds to asic inside system 3 tmds_d1+_sys tmds to asic inside system 4tmds_d1 ? _sys tmds to asic inside system 5 tmds_d0+_sys tmds to asic inside system 6tmds_d0 ? _sys tmd... |
| Description |
DVI and HDMI interface ESD and overcurrent protection, DDC-CEC buffering, hot plug detect and backdrive protection
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| File Size |
338.07K /
35 Page |
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it Online |
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California Micro Devices
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| Part No. |
CM1231
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| OCR Text |
...pf typical. ? improved powered asic latchup protection ? dramatic improvement in esd protection vs. best in class single-stage diode arrays ? 40% reduction in peak clamping voltage ? 40% reduction in peak residual current ? withstands ove... |
| Description |
Two-Channel PicoGuard XPTM ESD Clamp Protection Array
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| File Size |
256.63K /
11 Page |
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it Online |
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Micron Technology, Inc.
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| Part No. |
MT9M413C36STC
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| OCR Text |
...xternal devices: an fpga/cpld/asic controller, to manage the timing signals needed for sensor operation. a 20mm diagonal lens. biasing circuits and bypass capacitors. figure 1: a camera system usin g the mi-mv13 cmos image sensor c... |
| Description |
1.3-MEGAPIXEL CMOS ACTIVE-PIXEL DIGITAL IMAGE SENSOR
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| File Size |
493.12K /
30 Page |
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it Online |
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飞思卡尔半导体(中国)有限公司
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| Part No. |
MMA7450L MMA7450LR1 MMA7450LR2 MMA7450LT
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| OCR Text |
...ell) and a signal conditioning asic contained in a single package. the sensing element is sealed hermetically at the wafer level using a bulk micromachined cap wafer. the g-cell is a mechanical structure formed fr om semiconductor mater... |
| Description |
2g/4g/8g Three Axis Low-g Digital Output Accelerometer
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| File Size |
382.18K /
22 Page |
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it Online |
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飞思卡尔半导体(中国)有限公司
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| Part No. |
MMA7261QT07
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| OCR Text |
... ll) and a signal conditioning asic contained in a single integrated circuit package. the sensing elements are sealed herm etically at the wafer level using a bulk micromachined cap wafer. the g-cell is a mechanical structure formed fr... |
| Description |
.5g - 10g Three Axis Low-g Micromachined Accelerometer
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| File Size |
323.31K /
12 Page |
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it Online |
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飞思卡尔半导体(中国)有限公司
椋???″????浣?涓??)??????
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| Part No. |
MMA7260QT07
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| OCR Text |
...ell) and a signal conditioning asic contained in a single integrated circuit package. the sensing elements are sealed hermetically at the wafer level using a bulk micromachined cap wafer. the g-cell is a mechanical structure formed fro... |
| Description |
??.5g - 6g Three Axis Low-g Micromachined Accelerometer
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| File Size |
317.49K /
12 Page |
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it Online |
Download Datasheet |
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