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ELPIDA[Elpida Memory]
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Part No. |
EBE11UD8AGSA-6E-E EBE11UD8AGSA EBE11UD8AGSA-5C-E
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OCR Text |
...clock cycle time at CL = 4
3.80mm max. SO-DIMM Normal Weak Driver 50 ODT Support 3.75ns* 0.5ns* 5.0ns* 0.6ns* 15ns 7.5ns 15ns 45ns 512M bytes
1 1
Maximum data access time (tAC) from 0 clock at CL = 4 Minimum clock cycle time at CL = ... |
Description |
1GB DDR2 SDRAM SO-DIMM (128M words x 64 bits, 2 Ranks)
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File Size |
201.84K /
22 Page |
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PROTEC[Protek Devices]
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Part No. |
ESD6-DFN
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OCR Text |
...ENCLATURE
P3
0.50mm 0.020 1.80mm 0.071
1. Surface mount product is taped and reeled in accordance with EIA 481. 2. Suffix-T71 = 7 Inch Reel - 1,000 pieces per 8mm tape, i.e., ESD6-DFN-T71. 3. Suffix-T73 = 7 Inch Reel - 3,000 pieces p... |
Description |
LOW CAPACITANCE TVS ARRAY UNIDIRECTIONAL, 6 ELEMENT, SILICON, TVS DIODE
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File Size |
59.88K /
4 Page |
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it Online |
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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
FBGA-SD
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OCR Text |
... 1.0mm (VFBGA-SD/VFBGA-TSD) & 0.80mm (WFBGA-SD) maximum package thickness * Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution
FEATURES
* 2 die to 7 die stack with spacer capa... |
Description |
Fine Pitch Ball Grid Array - Stacked Die
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File Size |
555.83K /
2 Page |
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it Online |
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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
FLGA
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OCR Text |
... (TFLGA), 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness * Thinner than FBGA * Exposed thermal/mechanical lands available * Laminate substrate based enabling 2 and 4 layers of routing flexibility
FEATURES
* Low profile * Flexible ... |
Description |
Fine Pitch Land Grid Array
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File Size |
511.62K /
2 Page |
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it Online |
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Price and Availability
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