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  2816-4 Datasheet PDF File

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    TM128160CKFWG

List of Unclassifed Manufacturers
Part No. TM128160CKFWG
Description SPECIFICATION FOR LCD MODULE

File Size 291.29K  /  26 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    HY5DU281622AT

Hynix Semiconductor
Part No. HY5DU281622AT
Description (HY5DU28xxxAT) 3rd 128M DDR SDRAM

File Size 383.54K  /  37 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    TIANMA
Part No. TM128160DKFWF
Description LCD_Module

File Size 370.86K  /  26 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    HY5DU281622ET HY5DU28162 HY5DU281622ET-4 HY5DU281622ET-30 HY5DU281622ET-36 HY5DU281622ET-33 HY5DU281622ET-5 HY5DU281622E

HYNIX[Hynix Semiconductor]
Part No. HY5DU281622ET HY5DU28162 HY5DU281622ET-4 HY5DU281622ET-30 HY5DU281622ET-36 HY5DU281622ET-33 HY5DU281622ET-5 HY5DU281622ET-25 HY5DU281622ET-26 HY5DU281622ET-28
Description 128M(8Mx16) GDDR SDRAM

File Size 364.19K  /  34 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    TIANMA
Part No. TM128160EKFWG
Description LCD_Module

File Size 336.81K  /  23 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TIANMA
Part No. TM128160GKFWG
Description LCD_Module

File Size 524.15K  /  27 Page

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Amphenol Communications Solutions

Part No. 54122-816442250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 44 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    ETC[ETC]
Part No. TM128160CKFWG
Description SPECIFICATION FOR LCD MODULE

File Size 286.13K  /  26 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

   
Part No. HY5DV281622AT
Description 8Mx16|3.3V|4K|45|DDR SDRAM - 128M

File Size 275.50K  /  27 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

    Qimonda
Part No. HYI39S128160F
Description 128-MBit Synchronous DRAM

File Size 963.58K  /  21 Page

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Amphenol Communications Solutions

Part No. 54112-816202500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Hynix Semiconductor, Inc.
Part No. HY5DV281622DT-5 HY5DV281622DT-36 HY5DV281622DT-33
Description 128M(8Mx16) GDDR SDRAM 8M X 16 DDR DRAM, 0.7 ns, PDSO66

File Size 289.31K  /  31 Page

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Amphenol Communications Solutions

Part No. 54122-816202500LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 2816-4 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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