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  210c Datasheet PDF File

For 210c Found Datasheets File :: 322    Search Time::1.281ms    
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    SEOUL[Seoul Semiconductor]
Part No. SSC-FAT801
OCR Text ...eliminary heat to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 248.40K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-FCW100
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 451.52K  /  8 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-HBTS901
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description CHIP LED DEVICE

File Size 360.47K  /  10 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-HWTS901
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description CHIP LED DEVICE

File Size 464.61K  /  13 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-HWTS905
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description CHIP LED DEVICE

File Size 481.04K  /  13 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-KWT722
OCR Text ...eliminary heat to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 5 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105 ...
Description TOP LED DEVICE

File Size 540.99K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-KWT733
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 443.19K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-KWT821
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 549.85K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-KWT824
OCR Text ...minary heating to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 498.60K  /  11 Page

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    SEOUL[Seoul Semiconductor]
Part No. SSC-MBT801
OCR Text ...eliminary heat to be at maximum 210c for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds. 280 Device Surface Temperature [ C] 240 200 160 120 80 40 0 o 0 15 30 45 60 75 90 105...
Description TOP LED DEVICE

File Size 255.62K  /  8 Page

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For 210c Found Datasheets File :: 322    Search Time::1.281ms    
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