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wedge Datasheet PDF File

For wedge Found Datasheets File :: 956 Search Time::1.188ms
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				Hittite Microwave Corporation
Part No.	HMC527
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 8.5 - 13.5 GHz
File Size	267.06K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC528
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 11 - 16 GHz
File Size	267.84K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC553
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 7 - 14 GHz
File Size	240.25K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC554
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	257.00K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC555
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 31 - 38 GHz
File Size	290.11K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC556
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs MMIC I/Q MIXER 36 - 41 GHz
File Size	281.15K / 6 Page	View it Online	Download Datasheet

				DIALIGHT CORP
Part No.	586-2402-101 586-2402-105
OCR Text	...ange t 1 3/4 bi-pin t 1 3/4 wedge (t5) t 2 telephone slide t 3 1/4 miniature bayonet (ba9s) t 3 1/4 miniature screw (e10) t 3 1/4 wedge (t10) 15mm sc bayonet (ba15s) dialights line of based leds continues to grow. please visit...
Description	LED Lamp; Bulb Size:T-3 1/4; LED Color:Green; Luminous Intensity:2200ucd; Forward Current:15mA; Forward Voltage:6V; Operating Temperature Range:-30 C to C; Color:Green; Leaded Process Compatible:No; Lens Width:5 RoHS Compliant: No T-3 1/4 SINGLE COLOR LED, GREEN, 10.7 mm
File Size	94.16K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC564
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 13.5 GHz
File Size	266.63K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC565
OCR Text	...edule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire is recommended. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 6 - 20 GHz
File Size	283.34K / 6 Page	View it Online	Download Datasheet

For wedge Found Datasheets File :: 956 Search Time::1.188ms
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