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  LTE-2871 Datasheet PDF File

For LTE-2871 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    LTE42008R

NXP Semiconductors N.V.
Philips Semiconductors
Part No. LTE42008R
Description NPN microwave power transistor C BAND, Si, NPN, RF POWER TRANSISTOR

File Size 74.09K  /  12 Page

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Texas Instruments

Part No. LM3209TLX/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    LTE42005S

NXP Semiconductors
Philips Semiconductors
Part No. LTE42005S
Description NPN MICROWAVE POWER TRANSISTOR

File Size 52.83K  /  10 Page

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Texas Instruments

Part No. LM3209TLE/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

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Official Product Page

    0702871028

Molex Electronics Ltd.
Part No. 0702871028
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 60 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating

File Size 308.32K  /  6 Page

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Renesas Electronics Corporation

Part No. RYZ014A-NA-EVK
Description LTE Cat-M1 Cellular IoT Module Evaluation Kit
Tech specs    

Official Product Page

   
Part No. 2SK1875-BLTE85R
Description N-CHANNEL, Si, SMALL SIGNAL, JFET

File Size 87.82K  /  3 Page

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Renesas Electronics Corporation

Part No. RYZ014A-GB-EVK
Description LTE Cat-M1 Cellular IoT Module Evaluation Kit
Tech specs    

Official Product Page

    70287-1007 0702871007

Molex Electronics Ltd.
Part No. 70287-1007 0702871007
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240") Mating Pin Length, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with Retention Pin, 18 Circuits, 6.10mm (.240) Mating Pin Length, Tin (Sn) Plating

File Size 308.31K  /  6 Page

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Renesas Electronics Corporation

Part No. RTK7AECLD2S00001BU
Description AE-CLOUD2 - Global LTE IoT Connectivity Example
Tech specs    

Official Product Page

    0702871230

Molex Electronics Ltd.
Part No. 0702871230
Description 70287-1230

File Size 308.37K  /  6 Page

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Renesas Electronics Corporation

Part No. F1162NBGI
Description Dual RF to IF Downconverting Mixer for LTE
Tech specs    

Official Product Page

    0702871231

Molex Electronics Ltd.
Part No. 0702871231
Description 2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 74 Circuits, 6.10mm

File Size 308.36K  /  6 Page

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Renesas Electronics Corporation

Part No. RYZ014A000FZ00#HD0
Description LTE Cat-M1 Cellular IoT Module
Tech specs    

Official Product Page

    0702871080 70287-1080

Molex Electronics Ltd.
Part No. 0702871080 70287-1080
Description 2.54mm (.100") Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 66 Circuits
2.54mm (.100) Pitch C-Grid Header, Breakaway, Dual Row, Vertical, with Retention Pin, 66 Circuits

File Size 303.42K  /  5 Page

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Renesas Electronics Corporation

Part No. F1162NBGI8
Description Dual RF to IF Downconverting Mixer for LTE
Tech specs    

Official Product Page

    52435-2871 0524352871

Molex Electronics Ltd.
Part No. 52435-2871 0524352871
Description 0.50mm (.020") Pitch SMT Right-Angle FFC/FPC Connector, 28 Circuits, Gold (Au)Contact Plating
0.50mm (.020) Pitch SMT Right-Angle FFC/FPC Connector, 28 Circuits, Gold (Au)Contact Plating

File Size 409.40K  /  7 Page

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    0702871238

Molex Electronics Ltd.
Part No. 0702871238
Description 2.54mm (.100") Pitch C-Grid庐 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 88 Circuits, 6.10mm (.240") Mating Pin Length, 0.76渭m (30渭") Gold (Au) Se

File Size 308.23K  /  6 Page

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For LTE-2871 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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