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Amphenol Communications Solutions |
Part No. |
95278-502B24LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502B22LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-502B26LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10155502-B202KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 2 Position, STG, Top Latch, Tin (postplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10155502-B212KLF
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Description |
Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 12 Position, STG, Top Latch, Tin (postplated); B Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-402B28LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, Tin plating, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-802B26LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-802B24LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 24 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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CAL-CHIP ELECTRONICS INC
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Part No. |
WB1008CHGT82N-G WB1008CHGT82N-M WB0805CHGB22N-F WB0805CHSB22N-F WB1008CHSBR33-K WB1008CHSBR39-F CAL-CHIPELECTRONICSINC-WB0805CHGT56N-J CAL-CHIPELECTRONICSINC-WB1008FSB100-J WB0805CHSBR10-K WB0805CHSBR12-J WB1008CHGT12N-M GBR33-M SBR22-K SBR27-K WB1008CHGTR91-J WB1008CHSTR91-K WB0805CHGT82N-F
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Description |
1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.1 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.27 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD 1 ELEMENT, 0.91 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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File Size |
533.06K /
6 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
95278-102B26LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95278-802B28LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 28 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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Tech specs |
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Official Product Page
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