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http://
Molex Electronics Ltd.
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| Part No. |
90571-1349 0905711349
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, Tin
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, Tin
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| File Size |
274.69K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10137785-052141LF
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| Description |
Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Gold Flash plating, Natural Color, 5 Positions, Non GW Compatible, with Post, Tray packing.
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-1261 0905711261
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.1 μm Gold (Au)
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| File Size |
282.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-410041600LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-1302 0905711302
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.76 μm Gold (Au)
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| File Size |
275.08K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54121-419041650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 4 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-1309 0905711309
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, Tin
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, Tin
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| File Size |
274.69K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
91910-21415LF
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| Description |
Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Vertical Header, Surface Mount, 15 Positions, 1.00mm ( 0.039in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91900-21411LF
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| Description |
Conan® 1.00mm Pitch, Board To Board Connector, I - Industrial Series, Conan Vertical Header, Surface Mount, 11 Positions, 1.00mm (0.039in) Pitch
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-1342 0905711342
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, 0.76 μm Gold (Au)
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| File Size |
275.09K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
61082-141402LF
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| Description |
BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
90571-1301 0905711301
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| Description |
2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.1 μm Gold (Au)
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| File Size |
282.77K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
79821-412HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 12 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54121-416063050LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 6 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-3214-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8214-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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Official Product Page
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