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  75757-0261 Datasheet PDF File

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    0757576101 75757-6101

Molex Electronics Ltd.
http://
Part No. 0757576101 75757-6101
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 2.5um (100u) Tin (Sn) Plating

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Amphenol Communications Solutions

Part No. UE863T662020261
Description 2X6SFP ULTRAPORT WITH L/P
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0351 0757570351

Molex Electronics Ltd.
Part No. 75757-0351 0757570351
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits

File Size 99.22K  /  3 Page

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Amphenol Communications Solutions

Part No. 10025026-10203TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    75757-6261 0757576261

Molex Electronics Ltd.
Part No. 75757-6261 0757576261
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.25μm(50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10103TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    75757-6241 0757576241

Molex Electronics Ltd.
Part No. 75757-6241 0757576241
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 8 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10200TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    75757-6231 0757576231

Molex Electronics Ltd.
Part No. 75757-6231 0757576231
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 51940-261LF
Description PwrBlade®, Power Supply Connectors, 128S Vertical Receptacle.
Tech specs    

Official Product Page

    75757-6221 0757576221

Molex Electronics Ltd.
Part No. 75757-6221 0757576221
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10002PLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch .
Tech specs    

Official Product Page

    QUALITY SEMICONDUCTOR INC
Part No. QS7026A-20JI QS70261A-55TF
Description 16K X 16 DUAL-PORT SRAM, 20 ns, PQCC84
16K X 16 MULTI-PORT SRAM, 55 ns, PQFP100

File Size 601.76K  /  22 Page

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Amphenol Communications Solutions

Part No. 54122-410261920LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Toshiba
Part No. RN1309 RN1308 RN1307 E002614
Description SWITCHING, INVERTER CIRCUIT, INTERFACE CIRCUIT AND DRIVER CIRCUIT APPLICATIONS
From old datasheet system

File Size 196.37K  /  5 Page

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Amphenol Communications Solutions

Part No. 54122-810261100LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Toshiba
Part No. RN1242 RN1241 RN1244 E002612
Description FOR MUTING AND SWITCHING APPLICATIONS
From old datasheet system

File Size 91.20K  /  1 Page

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Amphenol Communications Solutions

Part No. UE863G242060261
Description 2X2SFP ULTRAPORT COMBO
Tech specs    

Official Product Page

    0351890261

Molex Electronics Ltd.
Part No. 0351890261
Description 4.75mm (.187) Tab, MP-Lock Housing, 2 Circuits 6.65mm (.261) Pitch, UL94V-0Natural

File Size 58.10K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-810261950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 75757-0261 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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