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  43650-0713 Datasheet PDF File

For 43650-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    0713491002 71349-1002

Molex Electronics Ltd.
Part No. 0713491002 71349-1002
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 8 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.47K  /  5 Page

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713491001 71349-1001

Molex Electronics Ltd.
Part No. 0713491001 71349-1001
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded, 6Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 421.48K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-107-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713086476

Molex Electronics Ltd.
Part No. 0713086476
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z1054071321
Description QSFP STACKED COMBO NO LP
Tech specs    

Official Product Page

    71308-5454 0713085454

Molex Electronics Ltd.
Part No. 71308-5454 0713085454
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    71308-5434 0713085434

Molex Electronics Ltd.
Part No. 71308-5434 0713085434
Description 2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 94 Circuits, 8.13mm (.320) Mating Pin Length, 0.76μm (30μ) Gold (Au) Selective

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    71308-5438 0713085438

Molex Electronics Ltd.
Part No. 71308-5438 0713085438
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50μm (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 78207-130
Description PV®Wire-to-Board Connector System, 2 Wall Shrouded Right angled Header - Through Hole - Double row - 30 Positions, 2.54mm (0.100in) pitch.
Tech specs    

Official Product Page

    71308-5440 0713085440

Molex Electronics Ltd.
Part No. 71308-5440 0713085440
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 40 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071341
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    71308-5442 0713085442

Molex Electronics Ltd.
Part No. 71308-5442 0713085442
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 42 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    71308-5444 0713085444

Molex Electronics Ltd.
Part No. 71308-5444 0713085444
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 44 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    71308-5446 0713085446

Molex Electronics Ltd.
Part No. 71308-5446 0713085446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 66207-136LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Vertical, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 43650-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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