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Molex Electronics Ltd.
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Part No. |
7400000'>29-8400 07400000'>298400
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Description |
0000'>2.00mm (.079) pitch VHDM? Board-to-Board Backplane Receptacle Power Module,vertical, 8-Row, 0000'>2 Circuits, Pin 0000'>2 Voided, Gold (Au) Selective 0.76μm (30μ) 0000'>2.00mm (.079") pitch VHDM庐 Board-to-Board Backplane Receptacle Power Module,vertical, 8-Row, 0000'>2 Circuits, Pin 0000'>2 Voided, Gold (Au) Selective 0.76渭m (30渭") 0000'>2.00mm (.079") pitch VHDM垄莽 Board-to-Board Backplane Receptacle Power Module,vertical, 8-Row, 0000'>2 Circuits, Pin 0000'>2 Voided, Gold (Au) Selective 0.76楼矛m (30楼矛")
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File Size |
226.81K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
08790000'>253000 8790000'>25-3000
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Description |
6.35mm (.0000'>250) pitch, Power, 0000'>2.54mm (.100) pitch, Signal, EXTreme PowerPlus Pa-S Receptacle, Press-fit, vertical, 0.76μm (30μ) Gold (Au)Plating, 33 Circuits 6.35mm (.0000'>250) pitch, Power, 0000'>2.54mm (.100) pitch, Signal, EXTreme PowerPlus?Pa-S Receptacle, Press-fit, vertical, 0.76μm (30μ) Gold (Au)Plating, 33 Circuits
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File Size |
187.24K /
4 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
0000'>2.54mm (.100) pitch C-Grid? Header, Through Hole, Dual Row, vertical, 36 Circuits, 0000'>2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 0000'>2.54mm (.100) pitch C-Grid庐 Header, Through Hole, Dual Row, vertical, 36 Circuits, 0000'>2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 0000'>2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, Dual Row, vertical, 36 Circuits, 0000'>2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-0000'>20000'>216 0879140000'>20000'>216
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Description |
0000'>2.54mm (.100) pitch C-Grid? Header, Through Hole, Dual Row, vertical, 0000'>20000'>2 Circuits, 0000'>2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 0000'>2.54mm (.100) pitch C-Grid庐 Header, Through Hole, Dual Row, vertical, 0000'>20000'>2 Circuits, 0000'>2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 0000'>2.54mm (.100) pitch C-Grid垄莽 Header, Through Hole, Dual Row, vertical, 0000'>20000'>2 Circuits, 0000'>2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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