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  001008-1089 Datasheet PDF File

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    0010897222 010-89-7222

Molex Electronics Ltd.
Part No. 0010897222 010-89-7222
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 421.82K  /  4 Page

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Amphenol Communications Solutions

Part No. 51731-089STLF
Description PwrBlade®, Power Connectors, 24S 6P Right Angle Header, Solder To Board
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0010897220 010-89-7220

Molex Electronics Ltd.
Part No. 0010897220 010-89-7220
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail

File Size 421.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 51939-1089LF
Description PwrBlade®, Power Supply Connectors, 8S 12P Right Angle Header.
Tech specs    

Official Product Page

    0010894146 10-89-4146

Molex Electronics Ltd.
Part No. 0010894146 10-89-4146
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, High Profile, Dual Row, Right Angle, 14 Circuits, 6.10mm (.240") Mating Pin Length
2.54mm (.100) Pitch C-Grid? Breakaway Header, High Profile, Dual Row, Right Angle, 14 Circuits, 6.10mm (.240) Mating Pin Length

File Size 119.91K  /  6 Page

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    0010897242 010-89-7242

Molex Electronics Ltd.
Part No. 0010897242 010-89-7242
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail

File Size 421.76K  /  4 Page

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    0010897240 010-89-7240

Molex Electronics Ltd.
Part No. 0010897240 010-89-7240
Description 2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Pl
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107) PC Tail

File Size 421.78K  /  4 Page

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    0510892805 51089-2805

Molex Electronics Ltd.
Part No. 0510892805 51089-2805
Description 2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 28Circuits

File Size 92.73K  /  2 Page

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    0510892405 51089-2405

Molex Electronics Ltd.
Part No. 0510892405 51089-2405
Description 2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 24Circuits
2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Dual Row, 24Circuits

File Size 92.74K  /  2 Page

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    0510892205 51089-2205

Molex Electronics Ltd.
Part No. 0510892205 51089-2205
Description 2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 22 Circuits

File Size 92.74K  /  2 Page

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    0510892005

Molex Electronics Ltd.
Part No. 0510892005
Description
File Size 92.74K  /  2 Page

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    0510893405 51089-3405

Molex Electronics Ltd.
Part No. 0510893405 51089-3405
Description 2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Dual Row, 34Circuits
2.00mm (.079") Pitch Mi II垄芒 System Wire-to-Board Crimp Housing, Dual Row, 34Circuits

File Size 92.74K  /  2 Page

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