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NIEC[Nihon Inter Electronics Corporation]
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| Part No. |
EC8FS6
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| OCR Text |
...on to Ambient *2 *1 Glass Epoxy Substrate Mounted (Soldering Lands=2x2mm,Both Sides) *2 Alumina Substrate Mounted (Soldering Lands=2x2mm,Both Sides)
EC_FS_ OUTLINE DRAWING (Dimensions in mm)
FORWARD CURRENT VS. VOLTAGE
EC8FS6
10
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| Description |
FRD - Low Power Loss, High Efficiency
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| File Size |
62.40K /
5 Page |
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it Online |
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APEX[Apex Microtechnology]
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| Part No. |
EK54
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| OCR Text |
...sal EVAL36 board and the EVAL46 substrate. The use of EVAL36 and EVAL46 allows for a large area of breadboarding space to work with while allowing a surface mount substrate for the PA60DK. The PA60DK amplifier may be surface mounted directl... |
| Description |
EVALUATION KIT FOR PA60DK
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| File Size |
247.23K /
2 Page |
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it Online |
Download Datasheet |
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ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
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| Part No. |
EMIF11-10002C4
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| OCR Text |
...h filter cell(filter4 to 12)
substrate
Vcc I3_die R3 10MEG 0 D1301 DEMIF30 D03 DEMIF22 substrate O3_die I1_die D02 DEMIF22 substrate O1_die
substrate
Substrate
Substrate
Substrate
Substrate
Substrate
R95 Rcorner
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| Description |
9 LINES EMI FILTER AND ESD PROTECTION
9线EMI滤波器和ESD保护
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| File Size |
300.02K /
6 Page |
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it Online |
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Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
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| Part No. |
F4655-12
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| OCR Text |
...PACITOR (150pF)
R 1M 2M 0.5M SUBSTRATE
RISE TIME: 400ps FALL TIME: 900ps FWHM : 750ps
-2.5kV
TMCPC0036EA
RESPONSE TIME (500ps/div)
NEGATIVE ION (or ELECTRON)
CAPACITOR (150pF 3)
TMCPB0038EA
2-STAGE MCP BNC
- ION (E... |
| Description |
COMPACT MCP ASSEMBLY FOR TOF
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| File Size |
55.53K /
2 Page |
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it Online |
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HAMAMATSU[Hamamatsu Corporation]
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| Part No. |
F6589
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| OCR Text |
...ut) MCP Out-Anode Voltage Anode-Substrate Voltage Operating Vacuum Condition Ambient Temperature Baking Temperature Baking Time Vacuum Condition for Baking * Not allowed to be baked. 2.0 0.4 2.4 Less than 6.7 x 10 -4 (5 x 10 -6) -50 to +70 ... |
| Description |
ULTRA THIN MCP ASSEMBLY WITH CENTER HOLE
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| File Size |
154.89K /
2 Page |
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it Online |
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STATSCHIP[STATS ChipPAC, Ltd.]
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| Part No. |
FBGA-SD
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| OCR Text |
substrate based enabling 2 & 4 layers of routing flexibility * FBGA-T-SD: Single metal layer tape based substrate with dense routing & good electrical performance * Available in 1.4mm (LFBGA-SD), 1.2mm (TFBGASD/TFBGA-T-SD), 1.0mm (VFBGA-SD/... |
| Description |
Fine Pitch Ball Grid Array - Stacked Die
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| File Size |
555.83K /
2 Page |
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it Online |
Download Datasheet |
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Price and Availability
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