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  soldered-in Datasheet PDF File

For soldered-in Found Datasheets File :: 23450    Search Time::3.453ms    
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    ROHM[Rohm]
Part No. MCH438FN476ZP MCH43 MCH432FN476JP MCH432FN476KP MCH432FN476MP MCH432FN476ZP MCH433FN476JP MCH433FN476KP MCH433FN476MP MCH433FN476ZP MCH434FN476JP MCH434FN476KP MCH434FN476MP MCH434FN476ZP MCH435FN476JP MCH435FN476KP MCH435FN476MP MCH435FN476ZP MCH438FN476JP MCH438FN476KP MCH438FN476MP
OCR Text ...10+/-1s shall be applied to the soldered specimens as shown by the arrow mark in the below sketch. Applied pressure Substrate Capacitor 4/10 MCH43 Ceramic capacitors No. 10 Bending strength Items Performance Test ...
Description Multi-layer ceramic chip capacitors

File Size 132.42K  /  11 Page

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    MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MC

ROHM[Rohm]
Part No. MCH558FN107ZP MCH55 MCH552FN107KP MCH552FN107MP MCH552FN107ZP MCH553FN107KP MCH553FN107ZP MCH554FN107KP MCH554FN107MP MCH554FN107ZP MCH555FN107KP MCH555FN107MP MCH555FN107ZP MCH558FN107KP MCH558FN107MP MCH553FN107MP
OCR Text ...10+/-1s shall be applied to the soldered specimens as shown by the arrow mark in the below sketch. Applied pressure Substrate Capacitor 3/9 MCH55 Ceramic capacitors No. 10 Bending strength Items Performance Test Method (As p...
Description Multi-layer ceramic chip capacitors

File Size 162.89K  /  10 Page

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    ROHM[Rohm]
Part No. MNA028CN105MK MNA02
OCR Text ...10+/-1s shall be applied to the soldered specimens as shown by the arrow mark in the below sketch. Applied pressure Capacitor Substrate 10 Bending strength Appearance Without mechanical damage. As per 4.35 of JIS C 5101-1....
Description (1005 (0402) x 2 size, chip capacitor networks)

File Size 75.48K  /  7 Page

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    MSE570_1 MSE570 MSE5701

List of Unclassifed Manufacturers
ETC[ETC]
Part No. MSE570_1 MSE570 MSE5701
OCR Text ...t emitting diodes. These may be soldered into their locations at the front of the board. LED1 LED2 LED3 LED4 LED5 green yellow red red yello...in without removal of the heatsink. The output of this oscillator may be connected directly to the s...
Description Bipolar Stepper Motor Drive Board

File Size 105.99K  /  5 Page

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    NFSW036T

List of Unclassifed Manufacturers
ETC[ETC]
NICHIA CORPORATION
Part No. NFSW036T
OCR Text ...%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material...
Description WHITE LED

File Size 817.79K  /  14 Page

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    NSSM016AT

NICHIA CORPORATION
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
Part No. NSSM016AT
OCR Text ...%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (si...
Description NICHIA CHIP TYPE FULL COLOR LED
From old datasheet system

File Size 284.88K  /  13 Page

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    TE Connectivity Ltd
Part No. 435166--5 435166--7 4--435626--1 4--435626--3 3--435626--6 4--435626--4 3--435626--7 3--435626--8 3--435626--9 4--435626--0 4--435626--2 4--435626--6 3--435166--0 5--435166--0 5--435166--1 3--435166--2 5--435166--2 5--435166--3 5--435166--4 5--435166--5 5--435166--7 2--435166--9 4--435166--9 1--435469--0 2--435469--1 3--435469--1 2--435469--2 3--435469--2 2--435469--3 2--435469--4 2--435469--5 2--435469--6 2--435470--1 3--435470--1 2--435470--2 3--435470--3 3--435470--2 2--435470--4 2--435470--5 2--435470--6
OCR Text ...ransparent seal application for soldered switch side--actuated switch (side rocker) pc board standard profile switch (raised rocker) rocker ...in 2 through 12 positions. they can be used in dip sockets with in--row contact centerline spacing o...
Description Dual In- Line Package
   Dual In- Line Package

File Size 111.86K  /  4 Page

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    NSSW020AT

List of Unclassifed Manufacturers
ETC[ETC]
Part No. NSSW020AT
OCR Text ...%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (si...
Description SPECIFICATION FOR NICHIA CHIP TYPE WHITE LED
From old datasheet system

File Size 243.21K  /  13 Page

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    Electronic Theatre Controls, Inc.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA06H8285M RA06H8285M-E01 RA06H8285M-01
OCR Text ...onsists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFE...in combination with load VSWR, and oscillation ESD: This MOSFET module is sensitive to ESD voltages ...
Description MITSUBISHI RF MOSFET MODULE

File Size 56.33K  /  8 Page

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For soldered-in Found Datasheets File :: 23450    Search Time::3.453ms    
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