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  75757-0261 Datasheet PDF File

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    75757-0242 0757570242

Molex Electronics Ltd.
Part No. 75757-0242 0757570242
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. UE863T662020261
Description 2X6SFP ULTRAPORT WITH L/P
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    75757-0251 0757570251

Molex Electronics Ltd.
Part No. 75757-0251 0757570251
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 99.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 10025026-10203TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    75757-6201 0757576201

Molex Electronics Ltd.
Part No. 75757-6201 0757576201
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10103TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0757576321 75757-6321

Molex Electronics Ltd.
Part No. 0757576321 75757-6321
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10200TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0757576281 75757-6281

Molex Electronics Ltd.
Part No. 0757576281 75757-6281
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25渭m (50渭) Nickel (Ni) Overall, 2.50渭m (100渭) Minimum Select Matte Tin (Sn) Plating on Ta
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail

File Size 166.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 51940-261LF
Description PwrBlade®, Power Supply Connectors, 128S Vertical Receptacle.
Tech specs    

Official Product Page

    0757576181 75757-6181

Molex Electronics Ltd.
http://
Part No. 0757576181 75757-6181
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 10025026-10002PLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch .
Tech specs    

Official Product Page

    0757576161 75757-6161

Molex Electronics Ltd.
http://
Part No. 0757576161 75757-6161
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-410261920LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0757576131 75757-6131

Molex Electronics Ltd.
http://
Part No. 0757576131 75757-6131
Description 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 2.5μm (100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.06K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-810261100LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 26 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0757576121 75757-6121

Molex Electronics Ltd.
http://
Part No. 0757576121 75757-6121
Description 3.50mm (.138") Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u") Tin (Sn) Plating
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 2.5um (100u) Tin (Sn) Plating

File Size 166.19K  /  4 Page

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Amphenol Communications Solutions

Part No. UE863G242060261
Description 2X2SFP ULTRAPORT COMBO
Tech specs    

Official Product Page

    0757576421 7575-76421

Molex Electronics Ltd.
Part No. 0757576421 7575-76421
Description 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.5μm (60μ)Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail Length

File Size 166.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-810261950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

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