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  71308-6444 Datasheet PDF File

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    713080150N

Molex Electronics Ltd.
Part No. 713080150N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits, 0.38μm Gold (Au) Selective Plating

File Size 26.96K  /  2 Page

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Amphenol Communications Solutions

Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    713084020N

Molex Electronics Ltd.
Part No. 713084020N
Description 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits, Tin (Sn) Plating, with 3.30mm PCB Locator Pegs

File Size 26.96K  /  2 Page

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Amphenol Communications Solutions

Part No. 10028916-4444P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs    

Official Product Page

    0713085404 71308-5404

Molex Electronics Ltd.
Part No. 0713085404 71308-5404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0713085406 71308-5406

Molex Electronics Ltd.
Part No. 0713085406 71308-5406
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713085408 71308-5408

Molex Electronics Ltd.
Part No. 0713085408 71308-5408
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713086446 71308-6446

Molex Electronics Ltd.
Part No. 0713086446 71308-6446
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 46 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)

File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions

Part No. 10147212-644406LF
Description Bergstak® Shielded 0.8mm Receptacle 64P
Tech specs    

Official Product Page

    0713085412 71308-5412

Molex Electronics Ltd.
Part No. 0713085412 71308-5412
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 67996-444HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    0713085414 71308-5414

Molex Electronics Ltd.
Part No. 0713085414 71308-5414
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713085424

Molex Electronics Ltd.
Part No. 0713085424
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0713085422

Molex Electronics Ltd.
Part No. 0713085422
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 68464-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 71308-6444 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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