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Amphenol Communications Solutions |
| Part No. |
10150526-1011HLF
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| Description |
2.0MM WIRE TO BOARD HEADER
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
85261-001LF
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| Description |
Din Accessory Locking Frame 3x16
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| Tech specs |
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Official Product Page
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Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
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| Part No. |
CY7C1372DV25-250BGC CY7C1370DV25-200AXI CY7C1372DV25-167BGXI CY7C1372DV25-200BGXC CY7C1372DV25-167AXIT CY7C1370DV25-200BGCT
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| Description |
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.6 ns, PBGA119
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PQFP100
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3.4 ns, PBGA119
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA119
1M X 18 ZBT SRAM, 3.4 ns, PQFP100
512K X 36 ZBT SRAM, 3 ns, PBGA119
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| File Size |
533.02K /
27 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68021-372HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106137-2000002LF
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| Description |
PwrBlade+® , Power Connectors, 2HDP PF, Vertical, Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJE724881372
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| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68021-372H
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
GSB3121372CHR
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| Description |
GSB3.2, A, GEN1, Vertical, DIP, 30u\\ GOLD, BLUE, TL 3.2MM
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68021-372
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106137-2010001LF
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| Description |
PwrBlade+® , Power Connectors, 40S+2HDP PF, Vertical, Header.
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| Tech specs |
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Official Product Page
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Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
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| Part No. |
CY7C1372CV25-167AI CY7C1372CV25-167BGI CY7C1372CV25-167AC CY7C1372CV25-167BGC CY7C1370CV25-250BZI CY7C1372CV25-250BZI CY7C1370CV25-225AC CY7C1372CV25-225AC CY7C1370CV25-225AI CY7C1372CV25-225AI CY7C1370CV25-225BGC CY7C1372CV25-225BGC CY7C1372CV25-225BGI CY7C1372CV25-225BZC CY7C1372CV25-250BGC CY7C1372CV25-200BGC CY7C1370CV25-167BZI CY7C1370CV25-225BGI CY7C1370CV25-167BGI CY7C1370CV25-250BGI CY7C1370CV25-200BGI CY7C1370CV25-225BZC CY7C1370CV25-250BGC CY7C1370CV25-250AC CY7C1370CV25-250AI CY7C1370CV25-167BGC CY7C1370CV25-200BGC CY7C1370CV25-167BZC CY7C1370CV25-167AC CY7C1370CV25-167AI CY7C1370CV25-200AC CY7C1370CV25-200BZC CY7C1372CV25-225BZI CY7C1372CV25-200BGI CY7C1372CV25-200BZI CY7C1372CV25-200AI
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| Description |
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 3 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA119
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 1M X 18 ZBT SRAM, 2.8 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PQFP100
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 512K X 36 ZBT SRAM, 3.4 ns, PBGA165
512K x 36/1M x 18 Pipelined SRAM with NoBLArchitecture 12k × 36/1M × 18流水线的SRAM架构的总线延迟
CAP,Ceramic,10000pF,500VDC,10-% Tol,10% Tol,X7R-TC Code,-15,15%-TC,30ppm-TC RoHS Compliant: Yes
512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
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| File Size |
498.10K /
27 Page |
View
it Online |
Download Datasheet |
| |
|
|
Amphenol Communications Solutions |
| Part No. |
RJE711881372
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| Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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