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  001118-4481 Datasheet PDF File

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    0011-18-5073 11-18-5073 0011185073

Molex Electronics Ltd.
Part No. 0011-18-5073 11-18-5073 0011185073
Description Conductor Punch

File Size 22.14K  /  1 Page

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Texas Instruments

Part No. MSP430F4481IPZ
Description 16-Bit Ultra-Low-Power MCU, 48kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0011184076

Molex Electronics Ltd.
Part No. 0011184076
Description Conductor Punch

File Size 22.22K  /  1 Page

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Texas Instruments

Part No. MSP430F4481IPZR
Description 16-Bit Ultra-Low-Power MCU, 48kB Flash, 2048B RAM, Comparator, 2 USARTs, HW Multiplier, 160 Seg LCD 100-LQFP -40 to 85
Tech specs    

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Official Product Page

    0011-18-4431 001118-4431 0011184431

Molex Electronics Ltd.
Part No. 0011-18-4431 001118-4431 0011184431
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 68001-118HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    01118-4703 011-18-4703 001118-4703 0011-18-4703 11184703 0011184703

Molex Electronics Ltd.
Part No. 01118-4703 011-18-4703 001118-4703 0011-18-4703 11184703 0011184703
Description Anvil

File Size 11.50K  /  1 Page

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Renesas Electronics Corporation

Part No. F4481LKGI
Description DIFF-In / SE-Out Quad Path TX DVGA - 400MHz to 1100MHz
Tech specs    

Official Product Page

    0011184342

Molex Electronics Ltd.
Part No. 0011184342
Description Combination Anvil

File Size 11.48K  /  1 Page

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Renesas Electronics Corporation

Part No. F4481LKGI8
Description DIFF-In / SE-Out Quad Path TX DVGA - 400MHz to 1100MHz
Tech specs    

Official Product Page

    11184343 011184343 0011184343

Molex Electronics Ltd.
Part No. 11184343 011184343 0011184343
Description Insulation Punch

File Size 11.48K  /  1 Page

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Renesas Electronics Corporation

Part No. F4481EVS
Description Evaluation System for the F4481 DIFF-In / SE-Out Quad Path TX DVGA
Tech specs    

Official Product Page

    0011-18-4432 001118-4432 0011184432

Molex Electronics Ltd.
Part No. 0011-18-4432 001118-4432 0011184432
Description Combination Anvil

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 75844-818-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0011184047 011-18-4047 0011-18-4047 001118-4047

Molex Electronics Ltd.
Part No. 0011184047 011-18-4047 0011-18-4047 001118-4047
Description Conductor Punch

File Size 14.35K  /  1 Page

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Amphenol Communications Solutions

Part No. 144-812F-11D
Description Paladin RPO, DO, 8-Pair, 14 Column, 1.5mm Wipe, NiS
Tech specs    

Official Product Page

    0011185106 1118-5106 11-18-5106 001118-5106 0011-18-5106

Molex Electronics Ltd.
Part No. 0011185106 1118-5106 11-18-5106 001118-5106 0011-18-5106
Description Conductor Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 144-812B-11H
Description Paladin RPO, DO, 8-Pair, 6 Column, 1.5mm Wipe, APP
Tech specs    

Official Product Page

    0011184046 11-18-4046 011-18-4046 0011-18-4046 001118-4046

Molex Electronics Ltd.
Part No. 0011184046 11-18-4046 011-18-4046 0011-18-4046 001118-4046
Description Insulation Punch

File Size 22.34K  /  1 Page

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Amphenol Communications Solutions

Part No. 144-812G-21H
Description Paladin RPO, DO, 8-Pair, 16 Column, 2.25mm Wipe, APP
Tech specs    

Official Product Page

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