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  HG-0113 Datasheet PDF File

For HG-0113 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0901301134 90130-1134

Molex Electronics Ltd.
Part No. 0901301134 90130-1134
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 586.18K  /  7 Page

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Rochester Electronics LLC

Part No. BLA1011-300
Description BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301136 90130-1136

Molex Electronics Ltd.
Part No. 0901301136 90130-1136
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 36 Circuits, Black, 3μm (118μ) Tin(Sn) over Nickel (Ni), Lead free

File Size 586.02K  /  7 Page

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Amphenol Communications Solutions

Part No. 10144700-113KLF
Description Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 13 Position,side to side,side latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    0705630113 70563-0113

Molex Electronics Ltd.
Part No. 0705630113 70563-0113
Description 2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .180 Pocket, Shrouded, 9Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 214.21K  /  4 Page

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Amphenol Communications Solutions

Part No. 68001-136H
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301138 90130-1138

Molex Electronics Ltd.
Part No. 0901301138 90130-1138
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.91K  /  7 Page

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Amphenol Communications Solutions

Part No. 68001-132HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    33011-3003 0330113003

Molex Electronics Ltd.
Part No. 33011-3003 0330113003
Description MX150 Male Terminal

File Size 613.79K  /  6 Page

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Amphenol Communications Solutions

Part No. 10112690-T01-13ULF
Description Header, Surface Mount, Double row, 26, 2mm (0.079in), Right Angle
Tech specs    

Official Product Page

    75900-1131 0759001131

Molex Electronics Ltd.
Part No. 75900-1131 0759001131
Description 3.50mm (.138) Pitch, MX150 Dual Row Header, Breakaway, Right Angle, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall

File Size 126.03K  /  3 Page

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Amphenol Communications Solutions

Part No. 10108777-10113MLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Through Hole, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0780011344 78001-1344

Molex Electronics Ltd.
Part No. 0780011344 78001-1344
Description 0.60mm (.024) Pitch miniDIMM DDR3 Socket, Surface Mount, Reverse Right Angle, with Off-White Latches, 1.5V Voltage Key, 244 Circuits, Type A Tray Packaging

File Size 403.04K  /  6 Page

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Amphenol Communications Solutions

Part No. 10069690-10113TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    0014601130

Molex Electronics Ltd.
Part No. 0014601130
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 26, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 157.54K  /  3 Page

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Amphenol Communications Solutions

Part No. 65801-137LF
Description Clincher™ Flex Connectors, Receptacle Assembly, Single Row, 8 Positions, 2.54mm (.100in) Pitch.
Tech specs    

Official Product Page

    33011-3002 0330113002

Molex Electronics Ltd.
Part No. 33011-3002 0330113002
Description MX150 Male Terminal, Silver (Ag) Plating, 16-20 AWG, Left Reel Payoff, ContactMaterial Thickness 0.30mm (.012)

File Size 615.73K  /  7 Page

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Amphenol Communications Solutions

Part No. 10113947-A0C-20DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

    0014601132

Molex Electronics Ltd.
Part No. 0014601132
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 28, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 156.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 10113947-C0C-40DLF
Description XCede® High Speed Backplane Connectors, Left polarizing guide module with key feature.
Tech specs    

Official Product Page

For HG-0113 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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