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  edge-connect architecture Datasheet PDF File

For edge-connect architecture Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    List of Unclassifed Man...
Part No. A0276396 A0277853 A0266828 A0269925 A0269923 A0270164 A0270168 A0277854
Description BIX Cross-Connect System

File Size 284.61K  /  6 Page

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    BQQ41 BNQ21

Cooper Bussmann, Inc.
Part No. BQQ41 BNQ21
Description Quick Connect Terminal Blocks

File Size 71.10K  /  1 Page

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    OCC-A-320-N OCC-A-320-P OCC-E-320-N OCC-E-320-P OCC-SPC8 OCC-CPR

MRV Communications, Inc.
http://
Part No. OCC-A-320-N OCC-A-320-P OCC-E-320-N OCC-E-320-P OCC-SPC8 OCC-CPR
Description OCC - Optical Cross Connect

File Size 69.94K  /  3 Page

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    Molex, Inc.
MOLEX INC
Part No. 45911-0013 45845-0003 45844-0003 45912-0008
Description Power Edge Assy 3 Seg Mixed PS Solder 12 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
Power Edge Assy Signal 4 Seg CPI 32 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, PRESS FIT
Power Edge Assy Signal 4 Seg Solder Tail 32 CONTACT(S), FEMALE, STRAIGHT SINGLE PART CARD EDGE CONN, SOLDER
Power Edge Assy Power / Signal CPI

File Size 391.72K  /  3 Page

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    Cypress Semiconductor Corp.
Cypress Semiconductor, Corp.
Part No. CY7C1165V18 CY7C1163V18 CY7C1161V18 CY7C1176V18 CY7C1161V18-300BZI CY7C1161V18-333BZI CY7C1163V18-300BZI CY7C1163V18-300BZC CY7C1165V18-300BZXC CY7C1165V18-333BZXC CY7C1165V18-333BZC CY7C1165V18-333BZI CY7C1165V18-333BZXI CY7C1165V18-300BZI CY7C1165V18-300BZC CY7C1165V18-300BZXI CY7C1163V18-333BZI CY7C1176V18-333BZXI CY7C1176V18-300BZXI CY7C1176V18-300BZC CY7C1163V18-300BZXC
Description 18-Mbit QDRII SRAM 4-Word Burst architecture (2.5 Cycle Read Latency) 2M X 9 QDR SRAM, 0.45 ns, PBGA165
18-Mbit QDRII SRAM 4-Word Burst architecture (2.5 Cycle Read Latency) 18兆位的国防评估报告⑩- II SRAM字突发架构(2.5周期读写延迟
18-Mbit QDR??II SRAM 4-Word Burst architecture (2.5 Cycle Read Latency)

File Size 949.91K  /  29 Page

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    CY7C1475V33-133BGXI CY7C1475V33-133BGI CY7C1475V33-117BGC CY7C1475V33-117BGI CY7C1475V33-117BGXC CY7C1475V33-117BGXI CY7

Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
Part No. CY7C1475V33-133BGXI CY7C1475V33-133BGI CY7C1475V33-117BGC CY7C1475V33-117BGI CY7C1475V33-117BGXC CY7C1475V33-117BGXI CY7C1471V33-117AXC CY7C1473V33-117AXC CY7C1471V33-117AXI CY7C1473V33-117AXI CY7C1471V33-117BZC CY7C1471V33-117BZI CY7C1471V33-117BZXC CY7C1471V33-117BZXI CY7C1471V33-133AXI CY7C1473V33-117BZC CY7C1471V33 CY7C1473V33-133AXI CY7C1473V33-117BZI
Description 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLarchitecture 4M X 18 ZBT SRAM, 8.5 ns, PBGA165
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBLarchitecture 4M X 18 ZBT SRAM, 6.5 ns, PQFP100
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL architecture(带NoBL结构B>72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM)
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL?/a> architecture
72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL垄芒 architecture

File Size 932.97K  /  32 Page

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    D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922-46

Harwin PLC
HARWIN INC
Part No. D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922-46
Description 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET
DIP22, IC SOCKET

File Size 238.38K  /  1 Page

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    CY7C1356A-100AC CY7C1356A-100BGC CY7C1356A-133AC CY7C1354A-133BGI CY7C1354A-166AC CY7C1354A-166BGC CY7C1354A-166BGI CY7C

Cypress Semiconductor
Part No. CY7C1356A-100AC CY7C1356A-100BGC CY7C1356A-133AC CY7C1354A-133BGI CY7C1354A-166AC CY7C1354A-166BGC CY7C1354A-166BGI CY7C1354A-133BGC CY7C1356A-166AC CY7C1354A-200AC CY7C1354A-200BGC CY7C1354A04 CY7C1356A-133AI
Description 256K x 36/512K x 18 Pipelined SRAM with NoBL垄芒 architecture
256K x 36/512K x 18 Pipelined SRAM with NoBL?/a> architecture
256K x 36/512K x 18 Pipelined SRAM with NoBL architecture

File Size 404.55K  /  28 Page

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    CY7C1370D-167AXI CY7C1370D-167BGC CY7C1370D-250BZC CY7C1370D-250BZXC CY7C1370D-250BZXI CY7C1370D06 CY7C1370D-250AXC CY7C

Cypress Semiconductor
Part No. CY7C1370D-167AXI CY7C1370D-167BGC CY7C1370D-250BZC CY7C1370D-250BZXC CY7C1370D-250BZXI CY7C1370D06 CY7C1370D-250AXC CY7C1370D-250AXI CY7C1370D-250BGC CY7C1370D-250BGI CY7C1370D-250BGXC CY7C1370D-250BGXI CY7C1370D-250BZI CY7C1372D-167BGXC CY7C1372D-250BGXC CY7C1372D-250BZXC CY7C1372D-250BGXI CY7C1370D-200BGXC CY7C1370D-200BGXI CY7C1370D-200BZXC CY7C1372D-200BGXC CY7C1372D-200BGXI CY7C1370D-167AXC CY7C1370D-167BGI CY7C1370D-167BGXC CY7C1370D-167BGXI CY7C1370D-167BZC CY7C1370D-167BZI CY7C1372D-200BZXI CY7C1372D-200BZXC CY7C1370D-200BZXI CY7C1372D-167BGXI CY7C1372D-167BZXC CY7C1372D-167BZXI CY7C1370D-167BZXC CY7C1370D-167BZXI
Description 18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL垄芒 architecture
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL architecture
18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL?/a> architecture

File Size 463.98K  /  28 Page

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    CY7C1351G-100AXC CY7C1351G-100AXI CY7C1351G-100BGC CY7C1351G-100BGI CY7C1351G-100BGXC CY7C1351G-100BGXI CY7C1351G-133AXC

Cypress Semiconductor
Part No. CY7C1351G-100AXC CY7C1351G-100AXI CY7C1351G-100BGC CY7C1351G-100BGI CY7C1351G-100BGXC CY7C1351G-100BGXI CY7C1351G-133AXC CY7C1351G-133AXI CY7C1351G-133BGC CY7C1351G-133BGI CY7C1351G-133BGXC CY7C1351G-133BGXI
Description 4-Mbit (128K x 36) Flow-through SRAM with NoBL architecture
4-Mbit (128K x 36) Flow-through SRAM with NoBL?/a> architecture
4-Mbit (128K x 36) Flow-through SRAM with NoBL⑩ architecture

File Size 395.70K  /  14 Page

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For edge-connect architecture Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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