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Amphenol Communications Solutions |
Part No. |
10128479-107500ULF
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Description |
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System, Hermaphroditic, Vertical, Press-Fit, 2 Pair, 13 Column, 104 Position, 7.50mm Stack Height, 2.00mm (0.079in) Column Pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7014 0791077014
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 30 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 30 Circuits
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File Size |
266.86K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69173-411HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7330 0791077330
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 12 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 12 Circuits
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File Size |
266.30K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69173-418HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7332 0791077332
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 16 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 16 Circuits
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File Size |
266.87K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-107-34-1150
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Description |
Unshrouded stacking vertical header, through hole, double Row, -3 position, 2.54mm pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
RJE4W4887341
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Description |
Modular Jacks, Input Output Connectors, 8P8C, Cat5e, Stacked 2x2, Shield, With LEDs
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7336 0791077336
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 24 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.05μm (2μ) Gold (Au) Selective Plating, 24 Circuits
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File Size |
266.87K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54242-807341400LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7013 0791077013
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 28 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 28 Circuits
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File Size |
266.86K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-107341050LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7009 0791077009
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 20 Circuits, 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 20 Circuits,
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File Size |
266.86K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69173-417HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7003 0791077003
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 8 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 8 Circuits
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File Size |
266.87K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
76347-341LF
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Description |
Dubox® Crimp-to-Wire 2.54mm Contact on Reel, 28-23 AWG Wire
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
79107-7015 0791077015
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 32 Circuits 2.00mm (.079) Pitch Milli-Grid Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38μm (15μ) Gold (Au) Selective Plating, 32 Circuits
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File Size |
266.86K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-107341150LF
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Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 34 position, 2.54mm (0.100in) pitch
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Tech specs |
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Official Product Page
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Price and Availability
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