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    0015800203 15-80-0203

Molex Electronics Ltd.
Part No. 0015800203 15-80-0203
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.27K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-31LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800681 15-80-0681

Molex Electronics Ltd.
Part No. 0015800681 15-80-0681
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-07LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0385 0015800385

Molex Electronics Ltd.
Part No. 15-80-0385 0015800385
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-807-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0581 0015800581

Molex Electronics Ltd.
Part No. 15-80-0581 0015800581
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-808HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800265

Molex Electronics Ltd.
Part No. 0015800265
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-27LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00419XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-804
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800369 15-80-0369

Molex Electronics Ltd.
Part No. 0015800369 15-80-0369
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-80-0285 0015800285

Molex Electronics Ltd.
Part No. 15-80-0285 0015800285
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0283 0015800283

Molex Electronics Ltd.
Part No. 15-80-0283 0015800283
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

View it Online

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Amphenol Communications Solutions

Part No. 77315-801-35LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For 1580 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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