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  1417-2 Datasheet PDF File

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    Infineon
Part No. HYB514171BJL-70 HYB514171BJL-60 HYB514171BJ-70
Description 256K x 16-Bit Dynamic RAM
File Size 1,069.70K  /  13 Page

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Amphenol Communications Solutions
Part No. 76341-417LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    HYB314171BJ-70 HYB314171BJL-70

Infineon Technologies AG
Part No. HYB314171BJ-70 HYB314171BJL-70
Description 256K X 16 FAST PAGE DRAM, 70 ns, PDSO40 0.400 INCH, PLASTIC, SOJ-40
File Size 438.12K  /  25 Page

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Amphenol Communications Solutions
Part No. 68771-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs 　 　

Official Product Page

   
Part No. HYB514175BJL-55
Description x16 EDO Page Mode DRAM
File Size 573.69K  /  24 Page

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Amphenol Communications Solutions
Part No. 54121-108141700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    SIEMENS AG
Part No. HYB514175BJ-50- Q67100-Q2100 HYB514175BJ-55 HYB514175BJ-60
Description 256k x 16-Bit EDO-DRAM 256k x 16位江户的DRAM
256k × 16-Bit Dynamic RAM(256k × 16动RAM) 256k × 16位动态随机存储器56k × 16位动态内存）
File Size 180.37K  /  22 Page

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Amphenol Communications Solutions
Part No. 77314-178LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

    Microchip Technology, Inc.
Part No. NN514170LJ-45 NN514170LJ-50 NN514170LJ-70 NN514170LJ-60 NN514170J-50 NN514170J-70 NN514170LTT-70 NN514170J-45
Description x16 Fast Page Mode DRAM x16快速页面模式的DRAM
File Size 654.84K  /  24 Page

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Amphenol Communications Solutions
Part No. 94611-417HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB314171BJL-70 HYB314171BJL-60 HYB314171BJL-50 HYB314171BJ-70 HYB314171BJ-60 HYB314171BJ-50 HB314171 HYB314171BJ-50-
Description 256k x 16 Bit FPM DRAM 3.3 V 60 ns
-3.3V 256 K x 16-Bit Dynamic RAM 3.3V Low Power 256 K x 16-Bit Dynamic RAM with Self Refresh
256k x 16 Bit FPM DRAM 3.3 V 70 ns
From old datasheet system
File Size 1,337.62K  /  24 Page

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Amphenol Communications Solutions
Part No. 10141731-005RLF
Description DDR4 SODIMM 260pin SMT, 5.2H, reverse version., Right Angle
Tech specs 　 　

Official Product Page

   
Part No. HM514170CLJ-7 HM514170CTT-7
Description x16 Fast Page Mode DRAM
File Size 653.03K  /  26 Page

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Amphenol Communications Solutions
Part No. 10141744-001LF
Description HPCE VT Receptacle 2LP20S
Tech specs 　 　

Official Product Page

    HYB514171BJ-50 HYB514171BJ-50- HYB514171BJ-60 Q67100-Q727 Q67100-Q2021

SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB514171BJ-50 HYB514171BJ-50- HYB514171BJ-60 Q67100-Q727 Q67100-Q2021
Description 256k x 16 Bit FPM DRAM 5 V 60 ns
256k x 16 Bit FPM DRAM 5 V 50 ns
256k x 16-Bit Dynamic RAM
File Size 179.75K  /  23 Page

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Amphenol Communications Solutions
Part No. 10141730-001RLF
Description DDR4 SODIMM 260pin SMT, 5.2H, Standard version, Right Angle
Tech specs 　 　

Official Product Page

    SIEMENS AG
Part No. HYB514171BJ-50- Q67100-Q727 Q67100-Q2021 HYB514171BJ-60
Description 256k x 16-Bit Dynamic RAM
256k × 16-Bit Dynamic RAM(256k × 16动RAM) 256k × 16位动态随机存储器56k × 16位动态内存）
File Size 184.28K  /  23 Page

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Amphenol Communications Solutions
Part No. 68461-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs 　 　

Official Product Page

    HYB514175BJ-60 HYB514175BJ-55 HYB514175BJ-50 Q67100-Q2072 Q67100-Q2073 HYB514175BJ-50- Q67100-Q2100

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB514175BJ-60 HYB514175BJ-55 HYB514175BJ-50 Q67100-Q2072 Q67100-Q2073 HYB514175BJ-50- Q67100-Q2100
Description 256k x 16 Bit EDO DRAM 5 V 50 ns
256k x 16 Bit EDO DRAM 5 V 60 ns
256k x 16 Bit EDO DRAM 5 V 55 ns
256k x 16-Bit EDO-DRAM
File Size 176.03K  /  22 Page

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Amphenol Communications Solutions
Part No. 77314-178TLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs 　 　

Official Product Page

For 1417-2 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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