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  easypack 2b module pressfit wi Datasheet PDF File

For easypack 2b module pressfit wi Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0736443000 73644-3000

Molex Electronics Ltd.
Part No. 0736443000 73644-3000
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location B, Polarizing Key Position A, 144 Circuits

File Size 164.67K  /  4 Page

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    0736443001 73644-3001

Molex Electronics Ltd.
Part No. 0736443001 73644-3001
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position A, 144 Circuits

File Size 174.87K  /  4 Page

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    0736443007 73644-3007

Molex Electronics Ltd.
Part No. 0736443007 73644-3007
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position D, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position D, 144 Circuits

File Size 174.33K  /  4 Page

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    0736443009 73644-3009

Molex Electronics Ltd.
Part No. 0736443009 73644-3009
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position E, 144 Circuits

File Size 174.33K  /  4 Page

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    0736443011 73644-3011

Molex Electronics Ltd.
Part No. 0736443011 73644-3011
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position F, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position F, 144 Circuits

File Size 174.33K  /  4 Page

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    0736443016 73644-3016

Molex Electronics Ltd.
Part No. 0736443016 73644-3016
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 164.68K  /  4 Page

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    0736443013 73644-3013

Molex Electronics Ltd.
Part No. 0736443013 73644-3013
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position G, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, pressfit, Guide Post Location A, Polarizing Key Position G, 144 Circuits

File Size 174.33K  /  4 Page

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    FS100R17PE4

Infineon Technologies AG
Part No. FS100R17PE4
Description EconoPACK鈩? Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und pressfit / NTC

File Size 1,709.02K  /  9 Page

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    FS100R12PT4

Infineon Technologies AG
Part No. FS100R12PT4
Description EconoPACK鈩? Modul mit schnellem Trench/Feldstopp IGBT4 und Emitter Controlled 4 Diode und pressfit / NTC

File Size 1,760.25K  /  9 Page

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    NXP Semiconductors N.V.
Stackpole Electronics, Inc.
Part No. 1792D-16BT0LP 1792D-4B0LP 1792D-2b2LP 1792D-4BT4LP 1792D-0BT16LP
Description module 16 OUT
module 4 IN 模块4中的
module 4 IN/4 OUT 模块4输入/ 4输出
module 16 IN 模块16
module 2 IN/2 OUT 模块2输入/ 2输出

File Size 362.35K  /  3 Page

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For easypack 2b module pressfit wi Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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