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adhesive Datasheet PDF File

For adhesive Found Datasheets File :: 7245 Search Time::2.297ms
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				Marktech Corporate
Part No.	MT5150-UR
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	5.0mm ROUND LED LAMP
File Size	153.00K / 6 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT5150-UG
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	5.0mm ROUND LED LAMP
File Size	153.64K / 6 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT5150-UGS
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	5.0mm ROUND LED LAMP
File Size	153.69K / 6 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	ILX518 ILX518K
OCR Text	...N 29N 29N 0.9Nm Ceramic portion adhesive (1) (2) (3) (4) Cover glass , , , , , , , , , , , , b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and...
Description	5363-pixel X 3 line CCD Linear Sensor (Color)
File Size	126.91K / 11 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT4363-HR-A
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	2.9mm ROUND LED LAMP
File Size	127.70K / 6 Page	View it Online	Download Datasheet

				Marktech Corporate
Part No.	MT4194-HR-A
OCR Text	...PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration ...
Description	1.0隆驴4.8mm RECTANGULAR LAMP(STEP TYPE) 1.0×4.8mm RECTANGULAR LAMP(STEP TYPE)
File Size	133.44K / 6 Page	View it Online	Download Datasheet

				Electronic Theatre Controls, Inc.
Part No.	XU66129.00
OCR Text	...6129.00 developmental monolayer adhesive film *trademark of the dow chemical company. ?see ?andling considerations?reverse side. form no. 299-50172-0801 smg (1)values are averages of typical film; not to be construed as specifications. xu 6...
Description	Developmental Monolayer adhesive Film
File Size	15.76K / 2 Page	View it Online	Download Datasheet

				ETC
Part No.	C2120Y
OCR Text	...re shall be no exposure of adhesive. 4. no more than 3 consecutive missing components are permitted. 5. a tape trailer, having at least three feed holes are required after the last component. 6. splices shall not interfere with the ...
Description	Search --To 2SC2120Y / CSC2120Y
File Size	116.14K / 3 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	SAB6456 SAB6456T
OCR Text	...must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maxi...
Description	Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:10-13 Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler
File Size	77.51K / 10 Page	View it Online	Download Datasheet

For adhesive Found Datasheets File :: 7245 Search Time::2.297ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |