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  90571-2143 Datasheet PDF File

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    0905712642

Molex Electronics Ltd.
Part No. 0905712642
Description 2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 64 Circuits, 0.76 μm Gold (Au)

File Size 350.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 86130502214345E1LF
Description 8613 M CNR LF
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90571-1102 0905711102

http://
Molex Electronics Ltd.
Part No. 90571-1102 0905711102
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 10 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 10 Circuits, 0.76 μm Gold (Au)

File Size 282.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 68021-436HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90571-1142 0905711142

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Molex Electronics Ltd.
Part No. 90571-1142 0905711142
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 14 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 14 Circuits, 0.76 μm Gold (Au)

File Size 282.87K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-143600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    90571-2601 0905712601

http://
Molex Electronics Ltd.
Part No. 90571-2601 0905712601
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 60 Circuits, 0.1 μm Gold (Au)

File Size 358.68K  /  5 Page

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Amphenol Communications Solutions

Part No. 79821-432HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 32 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    90571-2641 0905712641

http://
Molex Electronics Ltd.
Part No. 90571-2641 0905712641
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, 64 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, 64 Circuits, 0.1 μm Gold (Au)

File Size 358.67K  /  5 Page

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Amphenol Communications Solutions

Part No. 10134214-320424CLF
Description HPCE BTB RAH 36P24S WITH GUIDE
Tech specs    

Official Product Page

    90571-1301 0905711301

http://
Molex Electronics Ltd.
Part No. 90571-1301 0905711301
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.1 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 30 Circuits, 0.1 μm Gold (Au)

File Size 282.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 68021-438HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90571-1262 0905711262

http://
Molex Electronics Ltd.
Part No. 90571-1262 0905711262
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.76 μm Gold (Au)

File Size 275.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-143422LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    90571-1342 0905711342

http://
Molex Electronics Ltd.
Part No. 90571-1342 0905711342
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, 0.76 μm Gold (Au)
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, 0.76 μm Gold (Au)

File Size 275.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-143402LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    90571-1349 0905711349

http://
Molex Electronics Ltd.
Part No. 90571-1349 0905711349
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, Tin
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, Tin

File Size 274.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 61082-143522LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 140 Positions.
Tech specs    

Official Product Page

    90571-1269 0905711269

http://
Molex Electronics Ltd.
Part No. 90571-1269 0905711269
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, Tin
2.54mm (.100) Pitch QF-50 Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, Tin

File Size 274.69K  /  4 Page

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Amphenol Communications Solutions

Part No. 79821-430HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

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