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  71308-6444 Datasheet PDF File

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    91577-1308 0915771308

Molex Electronics Ltd.
Part No. 91577-1308 0915771308
Description 1.27mm (.050) Pitch Picoflex PF-50 IDT Receptacle, Low Profile, Alternative Stagger, Board-In, 8 Circuits
File Size 186.11K  /  4 Page

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Amphenol Communications Solutions
Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0713086420 71308-6420

Molex Electronics Ltd.
Part No. 0713086420 71308-6420
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10028916-4444P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs 　 　

Official Product Page

    71308-5456 0713085456

Molex Electronics Ltd.
Part No. 71308-5456 0713085456
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 56 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions
Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    71308-5454 0713085454

Molex Electronics Ltd.
Part No. 71308-5454 0713085454
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.55K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    71308-5452 0713085452

Molex Electronics Ltd.
Part No. 71308-5452 0713085452
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 52 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    71308-5426 0713085426

Molex Electronics Ltd.
Part No. 71308-5426 0713085426
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 26 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10147212-644406LF
Description Bergstak® Shielded 0.8mm Receptacle 64P
Tech specs 　 　

Official Product Page

    71308-5428 0713085428

Molex Electronics Ltd.
Part No. 71308-5428 0713085428
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 28 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 67996-444HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    71308-5450 0713085450

Molex Electronics Ltd.
Part No. 71308-5450 0713085450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    71308-5430 0713085430

Molex Electronics Ltd.
Part No. 71308-5430 0713085430
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    71308-5432 0713085432

Molex Electronics Ltd.
Part No. 71308-5432 0713085432
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 32 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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