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  1580 Datasheet PDF File

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    15-80-0083 0015800083

Molex Electronics Ltd.
Part No. 15-80-0083 0015800083
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati
Molex Electronics Ltd.

File Size 1,218.46K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-31LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 31 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    15-80-0605 0015800605

Molex Electronics Ltd.
Part No. 15-80-0605 0015800605
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 60 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-07LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 7 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800223

Molex Electronics Ltd.
Part No. 0015800223
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

File Size 1,218.21K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-807-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    15-80-0701 0015800701

Molex Electronics Ltd.
Part No. 15-80-0701 0015800701
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-808HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    15-80-0383 0015800383

Molex Electronics Ltd.
Part No. 15-80-0383 0015800383
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.08K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-27LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 27 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800641

Molex Electronics Ltd.
Part No. 0015800641
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Amphenol Communications Solutions

Part No. 10070158-00419XLF
Description D-Sub MicroTCA Connectors, Input Output Connectors, Single PCB Connector 24A 48V, Pin-in-Paste, Insert UNC 4.40, Carton Box.
Tech specs    

Official Product Page

    0015800449 15-80-0449

Molex Electronics Ltd.
Part No. 0015800449 15-80-0449
Description 2.54mm (.100") Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature

File Size 1,218.39K  /  7 Page

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Amphenol Communications Solutions

Part No. 75915-804
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 4 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800643

Molex Electronics Ltd.
Part No. 0015800643
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits

File Size 1,218.29K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0015800645

Molex Electronics Ltd.
Part No. 0015800645
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat

File Size 1,218.18K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-05LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 5 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0015800483

Molex Electronics Ltd.
Part No. 0015800483
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat

File Size 1,218.25K  /  7 Page

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Amphenol Communications Solutions

Part No. 77315-801-35LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

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