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  1315-212 Datasheet PDF File

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    TDA1315 TDA1315H TDA1315HN2

Philips Semiconductors
Part No. TDA1315 TDA1315H TDA1315HN2
Description Digital audio input/output circuit (DAIO)
DIGITAL AUDIO INPUT/OUTPUT CIRCUIT DAIO
File Size 409.97K  /  36 Page

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Amphenol Communications Solutions
Part No. 131-5118-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

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HUA FENG CIRCUIT





    MC13158FTB

Motorola, Inc
Part No. MC13158FTB
Description WIDEBAND FM IF SUBSYSTEM FOR DECT AND DIGITAL APPLICATIONS
File Size 634.14K  /  24 Page

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Amphenol Communications Solutions
Part No. 131-5514-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    http://
Part No. 0643201315
Description .635mm (.025), 1.50mm (.059), CMC Receptacle, 48 Circuits, Left Wire Output Green Coding, Mat Sealed
File Size 1,273.97K  /  5 Page

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Amphenol Communications Solutions
Part No. 131-5216-11H
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    TOKO INC
Part No. TK71315MBX
Description 1.5 V FIXED POSITIVE LDO REGULATOR, 0.25 V DROPOUT, PDSO5
File Size 602.19K  /  19 Page

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Amphenol Communications Solutions
Part No. 131-5518-11H
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    MC13159 MC13159DTB

Motorola, Inc
Part No. MC13159 MC13159DTB
Description WIDEBAND FM IF SUBSYSTEM FOR PHS AND DIGITAL APPLICATIONS
File Size 150.83K  /  8 Page

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Amphenol Communications Solutions
Part No. 131-5314-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    Pulse A Technitrol Comp...
Part No. GPSMOD1315
Description    Active GPS Antenna Modules 13mm x 13mm and 25 mm x 25 mm sizes
File Size 742.01K  /  10 Page

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Amphenol Communications Solutions
Part No. 131-5616-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    0026613150

Molex Electronics Ltd.
Part No. 0026613150
Description 3.96mm (.156") Pitch KK Solid Header, Right Angle, without Peg, 15 Circuits, Gold (Au) Plating
File Size 245.48K  /  10 Page

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Amphenol Communications Solutions
Part No. 131-5318-21H
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs 　 　

Official Product Page

    MC13158 MC13158FTB

MOTOROLA[Motorola, Inc]
Part No. MC13158 MC13158FTB
Description WIDEBAND FM IF SUBSYSTEM FOR DECT AND DIGITAL APPLICATIONS
File Size 378.34K  /  24 Page

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Amphenol Communications Solutions
Part No. 131-5414-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs 　 　

Official Product Page

    0901361315 90136-1315

Molex Electronics Ltd.
Part No. 0901361315 90136-1315
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 15 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
File Size 159.40K  /  4 Page

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Amphenol Communications Solutions
Part No. 131-5116-11H
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

    ENA1315A EMH2412-12

Sanyo Semicon Device
Part No. ENA1315A EMH2412-12
Description General-Purpose Switching Device Applications
File Size 207.86K  /  7 Page

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Amphenol Communications Solutions
Part No. 131-5418-11H
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs 　 　

Official Product Page

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