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AMI[AMI SEMICONDUCTOR]
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| Part No. |
PI3033B
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| OCR Text |
...o make the CIS Modules. The pad symbols and functions are described in Table 1.
7950 m
Row of 64 Sensors and Video Signal Multiplexers Readout Shift Register 500 m
Buffer SP
Buffer CP VDD DGND
Chip Select IOUT RSTLEV
Buffer ... |
| Description |
Contact Image Sensor
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| File Size |
867.72K /
13 Page |
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it Online |
Download Datasheet
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AMI[AMI SEMICONDUCTOR]
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| Part No. |
PI3034A
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| OCR Text |
...hip has 6 bonding pads. The pad symbols and functions are described in Table 1.
7950 m
1 2 3 4
Row of 64 Sensors and Video Signal Line Multiplexer Read Out Shift Register
61
62
63
64
290 m
Buffer
SI
Buffer
CLK ... |
| Description |
200DPI CIS Sensor Chip
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| File Size |
599.54K /
7 Page |
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it Online |
Download Datasheet |
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AMI[AMI SEMICONDUCTOR]
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| Part No. |
PI3039
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| OCR Text |
...hip has 6 bonding pads. The pad symbols and functions are described in Table 1.
Page 1 of 10, PI3039, 12/2/02
SYMBOL SP CP VDD VSS IOUT EOS
FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shift R... |
| Description |
600DPI CIS Image Sensor Chip
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| File Size |
600.22K /
10 Page |
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it Online |
Download Datasheet |
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| Part No. |
UPC1663GV-E1
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| OCR Text |
symbols parameters and conditions units min typ max i cc power supply current ma 13 20 a vd differential voltage gain: gain 1 200 320 500 gain 2 810 12 bw bandwidth (gain is 3 db down gain 1 mhz 120 from the gain at 100 khz) gain 2 mhz 700 ... |
| Description |
OP-AMP, PDSO8
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| File Size |
55.77K /
5 Page |
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it Online |
Download Datasheet |
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AMI[AMI SEMICONDUCTOR]
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| Part No. |
PI3041A
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| OCR Text |
...hip has 7 bonding pads. The pad symbols and functions are described in Table 1.
8080 m Row of 96 Sensors and Video Signal Multiplexers Readout Shift Register 380 m
Buffer SP
Buffer CP VDD DGND
Chip Select IOUT
Buffer AGND EOS
... |
| Description |
Contact Image Sensor 300DPI CIS Sensor Chip
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| File Size |
1,801.08K /
18 Page |
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it Online |
Download Datasheet |
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AMI[AMI SEMICONDUCTOR]
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| Part No. |
PI3042A
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| OCR Text |
...hip has 7 bonding pads. The pad symbols and functions are described in Table 1.
8080m 1 2 3
4
Row of 128 Sensors 125 and Video Signal Multiplexers Readout Shift Register
126
127
128
385m
Buffer SP
Buffer CP VDD DGND... |
| Description |
Contact Image Sensor Chip
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| File Size |
1,568.65K /
18 Page |
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it Online |
Download Datasheet |
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FUJI ELECTRIC HOLDINGS CO., LTD.
FUJI[Fuji Electric]
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| Part No. |
6MBP15RH-060 6MBP15RH
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| OCR Text |
...aximum Ratings
Items ( Tc=25C) symbols Ratings Max. 450 500 400 0 600 15 30 15 40 -0.3 20 1 0 VCC 15 150 -20 100 -40 125 2500 2.0 Units
IGBT IPM 600V 6x15A
n Outline Drawing
DC Bus Voltage VDC DC Bus Voltage (surge) VDC(Surge) DC ... |
| Description |
From old datasheet system
Intelligent Power Module ( RH-Series )
Intelligent Power Module ( RH-Series )
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| File Size |
168.19K /
4 Page |
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it Online |
Download Datasheet |
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Price and Availability
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