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MACOM[Tyco Electronics]
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| Part No. |
MA4AGSW1
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| OCR Text |
...rimarily be handled with vacuum pickups, or alternatively with plastic tweezers.
Ribbon/Wire Bonding
Wedge thermocompression bonding or ball bonding may be used to attach ribbons or wires to the RF bonding pads. Gold ribbons should be 1... |
| Description |
AlGaAs SPST Reflective PIN Diode Switch
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| File Size |
174.26K /
6 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MA4AGSW2
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| OCR Text |
...rimarily be handled with vacuum pickups, or alternatively with plastic tweezers.
Ribbon/Wire Bonding
Wedge thermocompression bonding or ball bonding may be used to attach ribbons or wires to the RF bonding pads. Gold ribbons should be 1... |
| Description |
AlGaAs SP2T PIN Diode Switch
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| File Size |
229.43K /
6 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4E2501L-1290W MA4E2501-1290 MA4E2501L-1290 MA4E2501L-1290T
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| OCR Text |
...astic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of... |
| Description |
SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE
SURMOUNTTM Low Barrier 0201 Footprint Silicon Schottky Diodes
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| File Size |
102.85K /
3 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4E2502M MA4E2502 MA4E2502H MA4E2502L
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| OCR Text |
...astic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of... |
| Description |
SURMOUNTTM Low, Medium and High Barrier Silicon Schottky Diodes
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| File Size |
270.60K /
4 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4E2508M MA4E2508 MA4E2508H MA4E2508L
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| OCR Text |
...astic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of... |
| Description |
SURMOUNTTM Low and Medium & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair
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| File Size |
98.58K /
4 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4E2513L-1289W MA4E2513 MA4E2513-1289 MA4E2513L-1289 MA4E2513L-1289T
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| OCR Text |
...astic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of... |
| Description |
SURMOUNT Low Barrier Tee ?301 Footprint Silicon Schottky Diodes
SURMOUNT Low Barrier Tee “0301” Footprint Silicon Schottky Diodes
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| File Size |
87.11K /
3 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4E2544L-1282W MA4E2544 MA4E2544L-1282 MA4E2544L-1282T
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| OCR Text |
...astic tipped tweezers or vacuum pickups is strongly recommended for individual components. The top surface of the die has a protective polyimide coating to minimize damage. The rugged construction of these SurMount devices allows the use of... |
| Description |
SURMOUNTTM Low Barrier Silicon Schottky Cross-Over Quad Series
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| File Size |
105.04K /
4 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA4FCP200
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| OCR Text |
...handled with tweezers or vacuum pickups and are suitable for use with automatic pick-and-place equipment.
Solder Die Attach Solder that does not scavenge gold, such as Indalloy #2, is recommended. Sn-Pb based solders are not recommended ... |
| Description |
Silicon Flip Chip PIN Diode
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| File Size |
38.13K /
2 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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