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Murata Manufacturing Co...
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| Part No. |
GRM0222C1C6R6DA03
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
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| File Size |
615.06K /
30 Page |
 View
it Online |
Download Datasheet
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Murata Manufacturing Co...
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| Part No. |
GRM0115C1E6R6DE01
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.012mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
616.14K /
30 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GJM0225C1E6R6DB01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness :0.8mm : solder resist (coat with heat resistant resin for solder) for gjm02... |
| Description |
Chip Monolithic Ceramic Capacitor High-Q Type for General
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| File Size |
585.77K /
25 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GRM0112C1E6R6DE01
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.012mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
616.13K /
30 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GJM1555C1H6R6DB01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness :0.8mm : solder resist (coat with heat resistant resin for solder) for gjm02... |
| Description |
Chip Monolithic Ceramic Capacitor High-Q Type for General
|
| File Size |
579.52K /
25 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GJM0335C1E6R6DB01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness :0.8mm : solder resist (coat with heat resistant resin for solder) for gjm02... |
| Description |
Chip Monolithic Ceramic Capacitor High-Q Type for General
|
| File Size |
579.39K /
25 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
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| Part No. |
GRM0335C2AR90WA01
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
619.27K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
|
Murata Manufacturing Co...
|
| Part No. |
GRM0335C2AR90BA01
|
| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
619.10K /
30 Page |
View
it Online |
Download Datasheet |
| |
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Murata Manufacturing Co...
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| Part No. |
GRM31M7U1H823JA01
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
617.72K /
30 Page |
View
it Online |
Download Datasheet |
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SHARP[Sharp Electrionic Components]
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| Part No. |
GP1S25J0000F
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| OCR Text |
...er : Styrene-Elastomer Aluminum laminated Bag : Nylon, Polyphernylene, Aluminum
Package method
MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. MAX. 40 sleeves with silica... |
| Description |
SMT, Gap : 1.6mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter
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| File Size |
174.06K /
11 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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