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Infineon
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| Part No. |
BFS466L6
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| Description |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages
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| File Size |
86.85K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
95278-102B44LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 44 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Infineon
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| Part No. |
BFS386L6
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| Description |
RF-Bipolar - NPN Silicon TWIN mixed type RF-Transistor in TSLP-6 package ideal for VCO Modules up to 4GHz
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| File Size |
104.37K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-102B10
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Infineon
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| Part No. |
BFS460L6
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| Description |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages
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| File Size |
130.78K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-102B36LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 36 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B26LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 26 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B46LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 46 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Infineon
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| Part No. |
BFS469L6
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| Description |
ESD-Hardened RF-Bipolar NPN Transistors in Standard SOT343 and TSLP-3 (single) & TSLP-6 (dual) Leadless Packages
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| File Size |
87.47K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95293-102B14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Single Row,14 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B22LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 22 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B34LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
95278-102B20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 20 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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