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  71308-6444 Datasheet PDF File

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    71308-5440 0713085440

Molex Electronics Ltd.
Part No. 71308-5440 0713085440
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 40 Circuits
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10135584-644402LF
Description Bergstak® 0.80mm Pitch, Board to Board Vertical Header, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0713086434 71308-6434

Molex Electronics Ltd.
Part No. 0713086434 71308-6434
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 34 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10028916-4444P00LF
Description AirMax® Power Connectors, Backplane Connectors, 2-Pair, 2 Column, Vertical Receptacle, Press-Fit
Tech specs 　 　

Official Product Page

    0713086416 71308-6416

Molex Electronics Ltd.
Part No. 0713086416 71308-6416
Description 2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 16 Circuits, 1.50um (59u) Minimum
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 77316-444LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 7 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    0713086412 71308-6412

Molex Electronics Ltd.
Part No. 0713086412 71308-6412
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-442HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 42 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0713086428 71308-6428

Molex Electronics Ltd.
Part No. 0713086428 71308-6428
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 28 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-440HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0713086422 71308-6422

Molex Electronics Ltd.
Part No. 0713086422 71308-6422
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 10147212-644406LF
Description Bergstak® Shielded 0.8mm Receptacle 64P
Tech specs 　 　

Official Product Page

    0713086436

Molex Electronics Ltd.
Part No. 0713086436
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
File Size 1,475.57K  /  8 Page

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Amphenol Communications Solutions
Part No. 67996-444HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

    0713085458 71308-5458

Molex Electronics Ltd.
Part No. 0713085458 71308-5458
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-446HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 46 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0713085462

Molex Electronics Ltd.
Part No. 0713085462
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 62 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions
Part No. 68464-448HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    78127-1308 0781271308

Molex Electronics Ltd.
Part No. 78127-1308 0781271308
Description 0.50mm (.020) Pitch FFC/FPC Connector, SMT, Non ZIF, Vertical, Reverse, Gold Plating
File Size 580.80K  /  9 Page

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Amphenol Communications Solutions
Part No. 68464-444HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 44 Positions, 2.54 mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

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